Automated design tool for examining microelectronic packaging design alternatives

Siew Wei Chin, Subramaniam D. Rajan, Ben K. Nagaraj, Mali Mahalingam

Research output: Chapter in Book/Report/Conference proceedingConference contribution


Microelectronic packaging design issues have been given greater attention mainly because the performance, reliability and cost of semiconductor chips are increasingly dictated by the choice and design of the package. The task of integrating the requirements imposed by different disciplines such as mechanical and thermal issues in an automated design tool, is discussed in this paper. Finite element analysis and nonlinear programming techniques are used in an iterative fashion to progress from an initial design concept to a design that satisfies all design requirements or one that is superior to other design alternatives. Two pcickaging design examples serve to illustrate the functionalities of the automated design optimization tool.

Original languageEnglish (US)
Title of host publication10th Biennial Conference on Reliability, Stress Analysis, and Failure Prevention
PublisherAmerican Society of Mechanical Engineers (ASME)
Number of pages14
ISBN (Electronic)9780791811726
StatePublished - 1993
EventASME 1993 Design Technical Conferences, DETC 1993 - Albuquerque, United States
Duration: Sep 19 1993Sep 22 1993

Publication series

NameProceedings of the ASME Design Engineering Technical Conference
VolumePart F167972-4


ConferenceASME 1993 Design Technical Conferences, DETC 1993
Country/TerritoryUnited States

ASJC Scopus subject areas

  • Mechanical Engineering
  • Computer Graphics and Computer-Aided Design
  • Computer Science Applications
  • Modeling and Simulation


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