Accelerated Durability Evaluation of Emerging Cell Interconnect Technologies

Fang Li, Dylan J. Colvin, Kristopher O. Davis, Andrew Gabor, Govinda Samy Tamizhmani

Research output: Chapter in Book/Report/Conference proceedingConference contribution


In this study, we investigate the durability of four different cell interconnect technologies using three long-term accelerated stress tests. The interconnect technologies investigated in this study are: conventional five busbar, tabbed interconnect ribbons (ribbon-tabbed); 12 busbar, soldered wire interconnects (soldered wire); shingled cell interconnects attached with an electrically conductive adhesive (shingled); and laminated wire interconnects with no busbar (laminated wire). The accelerated stress tests implemented in this study are: dynamic mechanical load followed by thermal cycling and humidity freeze (sequence 1); thermal cycling (500 cycles; sequence 2); damp heat (2000 hours; sequence 3). Overall, the average degradation of both modules in all the three sequences is found to be the lowest for the solder wire technology among the four investigated technologies assuming the influence of encapsulant and backsheet is identical in all the constructions.

Original languageEnglish (US)
Title of host publication2022 IEEE 49th Photovoltaics Specialists Conference, PVSC 2022
PublisherInstitute of Electrical and Electronics Engineers Inc.
Number of pages3
ISBN (Electronic)9781728161174
StatePublished - 2022
Event49th IEEE Photovoltaics Specialists Conference, PVSC 2022 - Philadelphia, United States
Duration: Jun 5 2022Jun 10 2022

Publication series

NameConference Record of the IEEE Photovoltaic Specialists Conference
ISSN (Print)0160-8371


Conference49th IEEE Photovoltaics Specialists Conference, PVSC 2022
Country/TerritoryUnited States


  • accelerated stress test
  • cell interconnection
  • durability
  • reliability
  • ribbon
  • wire interconnection

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering


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