A Testing Based Approach for Security Analysis of Smart Semiconductor Systems

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Digital factories have been recognized as a paradigm with considerable promise for improving manufacturing performance. Digital Twins have emerged as a powerful tool to improve control performance for large-scale smart manufacturing systems. We argue that DT-based smart factories are vulnerable to attacks that use the DT to damage the system while remaining undetectable, specifically in high-cost processes, where DT technologies are more likely to be deployed. As an instructive example, we look into smart semiconductor processes with focus on photolithography. To this end, we formulate a static optimization problem to maximize the damage of a cyber-attack against a photolithography digital twin that minimizes detectability to the process controller. Results demonstrate that this problem formulation provides attack policies that successfully reduce the throughput of the system at trade off of increased detectability to a common process control technique. Results encourage more research in the domain, especially to face scalability and policy-like solutions.

Original languageEnglish (US)
Title of host publication2023 Winter Simulation Conference, WSC 2023
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages2286-2297
Number of pages12
ISBN (Electronic)9798350369663
DOIs
StatePublished - 2023
Event2023 Winter Simulation Conference, WSC 2023 - San Antonio, United States
Duration: Dec 10 2023Dec 13 2023

Publication series

NameProceedings - Winter Simulation Conference
ISSN (Print)0891-7736

Conference

Conference2023 Winter Simulation Conference, WSC 2023
Country/TerritoryUnited States
CitySan Antonio
Period12/10/2312/13/23

ASJC Scopus subject areas

  • Software
  • Modeling and Simulation
  • Computer Science Applications

Fingerprint

Dive into the research topics of 'A Testing Based Approach for Security Analysis of Smart Semiconductor Systems'. Together they form a unique fingerprint.

Cite this