TY - GEN
T1 - A compressive-sensing based testing vehicle for 3D TSV pre-bond and post-bond testing data
AU - Huang, Hantao
AU - Yu, Hao
AU - Zhuo, Cheng
AU - Ren, Fengbo
N1 - Publisher Copyright:
© 2016 ACM.
PY - 2016/4/3
Y1 - 2016/4/3
N2 - Online testing vehicle is required for 3D TSV pre-bond and post-bond testing due to high probability of TSV failures. It has become a challenge to deal with large sets of generated testing data with limited probing when transmitting the data out. In this paper, a lossless compressive-sensing based testing vehicle is developed for online testing of TSVs. By exploring sparsity of the testing data under constraint of failure bound of TSV, sparse-representation based encoding can be deployed by XOR and AND network on chip to deal with large volume of testing data. Experimental results (with benchmarks) have shown that 89.70% pre-bond data compression rate can be achieved under 0.5% probability of failures; and 88.18% post-bond data compression rate can be achieved with 5% probability of failures.
AB - Online testing vehicle is required for 3D TSV pre-bond and post-bond testing due to high probability of TSV failures. It has become a challenge to deal with large sets of generated testing data with limited probing when transmitting the data out. In this paper, a lossless compressive-sensing based testing vehicle is developed for online testing of TSVs. By exploring sparsity of the testing data under constraint of failure bound of TSV, sparse-representation based encoding can be deployed by XOR and AND network on chip to deal with large volume of testing data. Experimental results (with benchmarks) have shown that 89.70% pre-bond data compression rate can be achieved under 0.5% probability of failures; and 88.18% post-bond data compression rate can be achieved with 5% probability of failures.
UR - http://www.scopus.com/inward/record.url?scp=84964871689&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84964871689&partnerID=8YFLogxK
U2 - 10.1145/2872334.2872351
DO - 10.1145/2872334.2872351
M3 - Conference contribution
AN - SCOPUS:84964871689
T3 - Proceedings of the International Symposium on Physical Design
SP - 19
EP - 25
BT - ISPD 2016 - Proceedings of the 2016 International Symposium on Physical Design
PB - Association for Computing Machinery
T2 - 2016 International Symposium on Physical Design, ISPD 2016
Y2 - 3 April 2016 through 6 April 2016
ER -