Wafer Bond Strength Evaluation Apparatus

Terry Alford

Wafer Bond Strength Evaluation Apparatus

Arizona State University

Research output: Patent

Abstract

ASU researchers have developed an improved apparatus for measuring the bond strength of wafers using the Maszara crack propogation technique. The device allows for greater accuracy and reproducability in measuring bond strength, facilitating a better understanding of the behavior of bonded wafers.

Original language	English (US)
State	Published - Jan 17 2003

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title = "Wafer Bond Strength Evaluation Apparatus",

abstract = "ASU researchers have developed an improved apparatus for measuring the bond strength of wafers using the Maszara crack propogation technique. The device allows for greater accuracy and reproducability in measuring bond strength, facilitating a better understanding of the behavior of bonded wafers.",

author = "Terry Alford",

year = "2003",

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language = "English (US)",

type = "Patent",

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AU - Alford, Terry

PY - 2003/1/17

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N2 - ASU researchers have developed an improved apparatus for measuring the bond strength of wafers using the Maszara crack propogation technique. The device allows for greater accuracy and reproducability in measuring bond strength, facilitating a better understanding of the behavior of bonded wafers.

AB - ASU researchers have developed an improved apparatus for measuring the bond strength of wafers using the Maszara crack propogation technique. The device allows for greater accuracy and reproducability in measuring bond strength, facilitating a better understanding of the behavior of bonded wafers.

M3 - Patent

ER -

Wafer Bond Strength Evaluation Apparatus

Abstract

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