Using Building Information Modeling to reduce risk and improve project delivery for semiconductor facilities

Building Information Modeling (BIM) is an approach gaining traction in the architect, engineer and construction (AEC) industry. BIM combines the ability to construct a virtual model with all aspects of a facility, from design to operations and maintenance. BIM directly relates to a project team's ability for Visualization, Understanding, Communication, and Collaboration. During the course of a project, information gradually increases in scope, depth, and relationship to the project. Within the semiconductor industry, the diversity and complexity of equipment creates difficult challenges for facilities design and equipment installation. This paper will focus on the benefits of BIM and how this process can be used to reduce risk and improve project delivery for new complex advanced technology facilities such as semiconductor manufacturing facilities. Risk reduction and a value-added construction process comes through improved understanding, coordination, and material use in the management of the project as well as fewer conflicts, waste, and cost. The concept of Intelligent Tool Models and Intelligent Fab Models are discussed to demonstrate the improved life-cycle facilitation of a semiconductor fabrication facility.