TY - JOUR
T1 - Ultra-low power radiation hardened by design memory circuits
AU - Chen, Tai Hua
AU - Chen, Jinhui
AU - Clark, Lawrence T.
AU - Knudsen, Jonathan E.
AU - Samson, Giby
N1 - Funding Information:
Manuscript received July 17, 2007; revised September 20, 2007. This work was supported in part by the Space Vehicles Directorate, Air Force Research Laboratory (AFRL), Kirkland AFB, Albuquerque, NM, under contract F29601-02-2-0299, and the Center for Design of Analog-Digital Integrated Circuits (CDADIC), Pullman, WA, under contract 10353G001943.
PY - 2007/12
Y1 - 2007/12
N2 - A 32 × 18 bit ultra-low power radiation-hardened by design (RHBD) register file is fabricated on a 130-nm bulk CMOS technology. Register file readout circuitry allows functionality down to V DD = 206 mV. Dual interlocked cell (DICE) storage provides SEU immunity above V DD = 450 mV in accelerated heavy ion testing. This memory is compared to a larger one using identical ultra low voltage circuit design techniques, but un-hardened, i.e., with conventional latch storage and using only two-edge transistor layout and no guard rings. The un-hardened ultra low voltage memory exhibits 100 × lower leakage post-irradiation to 500 krad(Si), when irradiated and measured at V DD = 500 mV, than when irradiated and measured with V DD = 1.2 V. Hence, for ultra-low power, ultra-low V DD circuits, TID hardening techniques may be unnecessary. Read energy dissipated by the RHBD memory is 10.3 f J per bit per operation when operated at 320 mV. The maximum operating frequency is 5 MHz at the same supply voltage.
AB - A 32 × 18 bit ultra-low power radiation-hardened by design (RHBD) register file is fabricated on a 130-nm bulk CMOS technology. Register file readout circuitry allows functionality down to V DD = 206 mV. Dual interlocked cell (DICE) storage provides SEU immunity above V DD = 450 mV in accelerated heavy ion testing. This memory is compared to a larger one using identical ultra low voltage circuit design techniques, but un-hardened, i.e., with conventional latch storage and using only two-edge transistor layout and no guard rings. The un-hardened ultra low voltage memory exhibits 100 × lower leakage post-irradiation to 500 krad(Si), when irradiated and measured at V DD = 500 mV, than when irradiated and measured with V DD = 1.2 V. Hence, for ultra-low power, ultra-low V DD circuits, TID hardening techniques may be unnecessary. Read energy dissipated by the RHBD memory is 10.3 f J per bit per operation when operated at 320 mV. The maximum operating frequency is 5 MHz at the same supply voltage.
KW - Dual interlocked cell (DICE)
KW - Radiation hardening
KW - Register file
KW - Subthreshold circuits
KW - Ultra-low power
UR - http://www.scopus.com/inward/record.url?scp=37249088991&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=37249088991&partnerID=8YFLogxK
U2 - 10.1109/TNS.2007.909909
DO - 10.1109/TNS.2007.909909
M3 - Article
AN - SCOPUS:37249088991
SN - 0018-9499
VL - 54
SP - 2004
EP - 2011
JO - IEEE Transactions on Nuclear Science
JF - IEEE Transactions on Nuclear Science
IS - 6
ER -