Three-dimensional microstructure characterization of Ag3Sn intermetallics in Sn-rich solder by serial sectioning

R. S. Sidhu; Nikhilesh Chawla

doi:10.1016/j.matchar.2004.04.010

Three-dimensional microstructure characterization of Ag₃Sn intermetallics in Sn-rich solder by serial sectioning

R. S. Sidhu, Nikhilesh Chawla

Chemical Engineering

Research output: Contribution to journal › Article › peer-review

72 Scopus citations

Abstract

Three-dimensional microstructure characterization of Ag₃Sn intermetallics in Sn-rich solder was investigated. The 3D microstructure of near-eutectic Sn-3.5Ag solder was modeled by computer-aided reconstruction of micrographs. The serial sectioning process enabled the reconstruction, visualization, and measurement of the size and aspect ratio of the solder. A comparison of size and aspect ratio from 2D and 3D measurements shows that measurements in 3D are much more accurate.

Original language	English (US)
Pages (from-to)	225-230
Number of pages	6
Journal	Materials Characterization
Volume	52
Issue number	3
DOIs	https://doi.org/10.1016/j.matchar.2004.04.010
State	Published - Jun 2004

ASJC Scopus subject areas

Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

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10.1016/j.matchar.2004.04.010

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title = "Three-dimensional microstructure characterization of Ag3Sn intermetallics in Sn-rich solder by serial sectioning",

abstract = "Three-dimensional microstructure characterization of Ag3Sn intermetallics in Sn-rich solder was investigated. The 3D microstructure of near-eutectic Sn-3.5Ag solder was modeled by computer-aided reconstruction of micrographs. The serial sectioning process enabled the reconstruction, visualization, and measurement of the size and aspect ratio of the solder. A comparison of size and aspect ratio from 2D and 3D measurements shows that measurements in 3D are much more accurate.",

author = "Sidhu, {R. S.} and Nikhilesh Chawla",

year = "2004",

month = jun,

doi = "10.1016/j.matchar.2004.04.010",

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AU - Sidhu, R. S.

AU - Chawla, Nikhilesh

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N2 - Three-dimensional microstructure characterization of Ag3Sn intermetallics in Sn-rich solder was investigated. The 3D microstructure of near-eutectic Sn-3.5Ag solder was modeled by computer-aided reconstruction of micrographs. The serial sectioning process enabled the reconstruction, visualization, and measurement of the size and aspect ratio of the solder. A comparison of size and aspect ratio from 2D and 3D measurements shows that measurements in 3D are much more accurate.

AB - Three-dimensional microstructure characterization of Ag3Sn intermetallics in Sn-rich solder was investigated. The 3D microstructure of near-eutectic Sn-3.5Ag solder was modeled by computer-aided reconstruction of micrographs. The serial sectioning process enabled the reconstruction, visualization, and measurement of the size and aspect ratio of the solder. A comparison of size and aspect ratio from 2D and 3D measurements shows that measurements in 3D are much more accurate.

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Three-dimensional microstructure characterization of Ag₃Sn intermetallics in Sn-rich solder by serial sectioning

Abstract

ASJC Scopus subject areas

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