TY - JOUR
T1 - Thermal fatigue behavior of Sn-Rich (Pb-Free) solders
AU - Sidhu, R. S.
AU - Chawla, Nikhilesh
N1 - Funding Information:
The authors gratefully acknowledge financial support for this research from the National Science Foundation under Contract No. DMR-0092530 (Drs. H. Chopra, S. Ankem, B. Macdonald, and K.L. Murty, program managers). The authors also thank the Indium Corporation for providing the solder alloys used in this study.
PY - 2008/4
Y1 - 2008/4
N2 - The thermal fatigue resistance of Sn-rich solder joints is dependent on the initial microstructure and damage evolution during thermal cycling. In this study, we have investigated the thermal fatigue behavior of single-lap-shear Sn-rich solder/Cu joints under cyclic thermal loading. Microstructure characterization of the initial and damaged solder-joint microstructures was studied using scanning electron microscopy (SEM). Persistent slip band formation, followed by crack nucleation and propagation at the tip of the lap-shear geometry, took place. The influence of the Sn grain orientation on the thermal fatigue damage was modeled using the finite-element method (FEM). The grain orientation was determined by orientation image mapping (OIM), and a Schmid factor analysis was performed to determine the active slip systems in the Sn grains. It was found that the geometry of the lap-shear joint, rather than the Sn grain orientation, was more significant in determining the location of crack initiation.
AB - The thermal fatigue resistance of Sn-rich solder joints is dependent on the initial microstructure and damage evolution during thermal cycling. In this study, we have investigated the thermal fatigue behavior of single-lap-shear Sn-rich solder/Cu joints under cyclic thermal loading. Microstructure characterization of the initial and damaged solder-joint microstructures was studied using scanning electron microscopy (SEM). Persistent slip band formation, followed by crack nucleation and propagation at the tip of the lap-shear geometry, took place. The influence of the Sn grain orientation on the thermal fatigue damage was modeled using the finite-element method (FEM). The grain orientation was determined by orientation image mapping (OIM), and a Schmid factor analysis was performed to determine the active slip systems in the Sn grains. It was found that the geometry of the lap-shear joint, rather than the Sn grain orientation, was more significant in determining the location of crack initiation.
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U2 - 10.1007/s11661-008-9480-y
DO - 10.1007/s11661-008-9480-y
M3 - Article
AN - SCOPUS:40549124356
SN - 1073-5623
VL - 39 A
SP - 799
EP - 810
JO - Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
JF - Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
IS - 4
ER -