TY - JOUR
T1 - Thermal boundary resistance for thin-film high-Tc superconductors at varying interfacial temperature drops
AU - Kelkar, Mukul
AU - Phelan, Patrick
AU - Gu, Bei
N1 - Funding Information:
Acknowledgements-This material is based upon work supported by the National Science Foundation under Grant no. CTS-9696002. The authors owe their gratitude to Professor K. Hijikata of the Tokyo Institute of Technology and H. Ito of the Mitsubishi Electric Company, who furnished the highT, samples and to Professor J. R. Gaines of the University of Hawaii, who allowed us to use his cryogenic laboratory facilities.
PY - 1997/7
Y1 - 1997/7
N2 - High-temperature thin-film superconducting devices are becoming commonplace for applications such as Josephson junctions, superconducting quantum interference devices, interconnects and radiation bolometers. The thermal stability of these devices is critical and for effective heat transfer it is required to know the thermal boundary resistance at the interface of the high-Tc thin films and their substrates. Many measurements of thermal contact resistance for bulk samples and metallic thin films have been reported, but only a few measurements have been made for high-Tc films. In the present study, the thermal boundary resistance between Er-Ba-Cu-O films on MgO and SrTiO3 substrates is measured as a function of both temperature and the applied heat flux, and for the first time at temperatures as low as 19 K. The boundary resistance shows a decrease with increasing heat flux. Possible explanations for this trend are given by three proposed hypotheses.
AB - High-temperature thin-film superconducting devices are becoming commonplace for applications such as Josephson junctions, superconducting quantum interference devices, interconnects and radiation bolometers. The thermal stability of these devices is critical and for effective heat transfer it is required to know the thermal boundary resistance at the interface of the high-Tc thin films and their substrates. Many measurements of thermal contact resistance for bulk samples and metallic thin films have been reported, but only a few measurements have been made for high-Tc films. In the present study, the thermal boundary resistance between Er-Ba-Cu-O films on MgO and SrTiO3 substrates is measured as a function of both temperature and the applied heat flux, and for the first time at temperatures as low as 19 K. The boundary resistance shows a decrease with increasing heat flux. Possible explanations for this trend are given by three proposed hypotheses.
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U2 - 10.1016/S0017-9310(96)00279-7
DO - 10.1016/S0017-9310(96)00279-7
M3 - Article
AN - SCOPUS:0031176935
SN - 0017-9310
VL - 40
SP - 2637
EP - 2645
JO - International Journal of Heat and Mass Transfer
JF - International Journal of Heat and Mass Transfer
IS - 11
ER -