Abstract
Nanostructured Cu–Ta alloys show promise as high-strength materials in part due to their limited grain growth. In the present study, we elucidate the role of Ta on the transition from deformation twinning to dislocation-mediated slip mechanisms in nanocrystalline Cu through atomistic simulations and transmission electron microscopy characterization. In particular, computed generalized stacking fault energy curves show that as Ta content increases there is a shift from twinning to slip-dominated deformation mechanisms. Furthermore, heterogeneous twinnability from microstructural defects decreases with an increase in Ta. The computed effect of Ta on plasticity is consistent with the HRTEM observations.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 48-54 |
| Number of pages | 7 |
| Journal | Materials Research Letters |
| Volume | 5 |
| Issue number | 1 |
| DOIs | |
| State | Published - Jan 2 2017 |
Keywords
- Nanocrystalline
- TEM
- dislocation
- twinning
ASJC Scopus subject areas
- General Materials Science
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