TY - GEN
T1 - Robot-Mounted Ultrasonic Micro-Wire Bonding Tool for Structural Electronics and Sensors
AU - Tofangchi, Alireza
AU - Caid, Cassidy
AU - Wei, Danming
AU - Hsu, Keng
AU - Popa, Dan O.
N1 - Publisher Copyright:
Copyright © 2024 by a non-US government agency.
PY - 2024
Y1 - 2024
N2 - This research describes the development of a cost-effective ultrasonic wire bonding system, which was later integrated into an industrial robot to enhance welding automation. Initially, the team developed an innovative 3D printed adapter to attach the ultrasonic transducer to the tool tip, along with a 3D Gantry platform for manual wire bonding to determine the optimal process conditions. The study examined the influence of different variables, such as wire type and size, ultrasonic power and duration, and mechanical pressure. In the follow-up phase, the system was further enhanced by integrating the ultrasonic tool with a robotic arm having six degrees of freedom. A control law was developed using the calculated arm stiffness. Through experimental testing, which varied compression strength and pulse duration, the team attempted to identify effective operating conditions via destructive bond strength analysis. This integration significantly improved the system's functionality, allowing for more precise automated wire bonding and better data collection for process control. Practical applications demonstrated include automated wire bonding and cutting on aluminum plates and printed circuit boards with small features, using aluminum and gold wires of various diameters. The system's ability to cut wires in-process allows continuous bonding at different locations without halting the process. Future objectives include implementing real-time monitoring of bonding failures using data-driven methods.
AB - This research describes the development of a cost-effective ultrasonic wire bonding system, which was later integrated into an industrial robot to enhance welding automation. Initially, the team developed an innovative 3D printed adapter to attach the ultrasonic transducer to the tool tip, along with a 3D Gantry platform for manual wire bonding to determine the optimal process conditions. The study examined the influence of different variables, such as wire type and size, ultrasonic power and duration, and mechanical pressure. In the follow-up phase, the system was further enhanced by integrating the ultrasonic tool with a robotic arm having six degrees of freedom. A control law was developed using the calculated arm stiffness. Through experimental testing, which varied compression strength and pulse duration, the team attempted to identify effective operating conditions via destructive bond strength analysis. This integration significantly improved the system's functionality, allowing for more precise automated wire bonding and better data collection for process control. Practical applications demonstrated include automated wire bonding and cutting on aluminum plates and printed circuit boards with small features, using aluminum and gold wires of various diameters. The system's ability to cut wires in-process allows continuous bonding at different locations without halting the process. Future objectives include implementing real-time monitoring of bonding failures using data-driven methods.
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U2 - 10.1115/MSEC2024-125487
DO - 10.1115/MSEC2024-125487
M3 - Conference contribution
AN - SCOPUS:85203682661
T3 - Proceedings of ASME 2024 19th International Manufacturing Science and Engineering Conference, MSEC 2024
BT - Manufacturing Equipment and Automation; Manufacturing Processes; Manufacturing Systems; Nano/Micro/Meso Manufacturing; Quality and Reliability
PB - American Society of Mechanical Engineers (ASME)
T2 - ASME 2024 19th International Manufacturing Science and Engineering Conference, MSEC 2024
Y2 - 17 June 2024 through 21 June 2024
ER -