Robot-Mounted Ultrasonic Micro-Wire Bonding Tool for Structural Electronics and Sensors

Alireza Tofangchi, Cassidy Caid, Danming Wei, Keng Hsu, Dan O. Popa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This research describes the development of a cost-effective ultrasonic wire bonding system, which was later integrated into an industrial robot to enhance welding automation. Initially, the team developed an innovative 3D printed adapter to attach the ultrasonic transducer to the tool tip, along with a 3D Gantry platform for manual wire bonding to determine the optimal process conditions. The study examined the influence of different variables, such as wire type and size, ultrasonic power and duration, and mechanical pressure. In the follow-up phase, the system was further enhanced by integrating the ultrasonic tool with a robotic arm having six degrees of freedom. A control law was developed using the calculated arm stiffness. Through experimental testing, which varied compression strength and pulse duration, the team attempted to identify effective operating conditions via destructive bond strength analysis. This integration significantly improved the system's functionality, allowing for more precise automated wire bonding and better data collection for process control. Practical applications demonstrated include automated wire bonding and cutting on aluminum plates and printed circuit boards with small features, using aluminum and gold wires of various diameters. The system's ability to cut wires in-process allows continuous bonding at different locations without halting the process. Future objectives include implementing real-time monitoring of bonding failures using data-driven methods.

Original languageEnglish (US)
Title of host publicationManufacturing Equipment and Automation; Manufacturing Processes; Manufacturing Systems; Nano/Micro/Meso Manufacturing; Quality and Reliability
PublisherAmerican Society of Mechanical Engineers (ASME)
ISBN (Electronic)9780791888117
DOIs
StatePublished - 2024
Externally publishedYes
EventASME 2024 19th International Manufacturing Science and Engineering Conference, MSEC 2024 - Knoxville, United States
Duration: Jun 17 2024Jun 21 2024

Publication series

NameProceedings of ASME 2024 19th International Manufacturing Science and Engineering Conference, MSEC 2024
Volume2

Conference

ConferenceASME 2024 19th International Manufacturing Science and Engineering Conference, MSEC 2024
Country/TerritoryUnited States
CityKnoxville
Period6/17/246/21/24

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering

Fingerprint

Dive into the research topics of 'Robot-Mounted Ultrasonic Micro-Wire Bonding Tool for Structural Electronics and Sensors'. Together they form a unique fingerprint.

Cite this