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Rate-dependent behavior of Sn3.8Ag0.7Cu solder over strain rates of 10 -6 to 102 s-1

  • X. Nie
  • , D. Bhate
  • , D. Chan
  • , W. Chen
  • , G. Subbarayan
  • , I. Dutta

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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