Keyphrases
Electron Backscatter Diffraction
100%
Preparation Method
100%
Lead-free Solder Joints
100%
Multilayer Specimen
100%
Ag-Cu
33%
Multiple Layers
33%
Phase Detection
33%
Polishing Step
33%
Vibratory Polishing
33%
Diffraction Pattern
16%
Stiffness
16%
Microstructure
16%
Processing Parameters
16%
Specimen Preparation
16%
Soldering
16%
Crystal Orientation
16%
Grain Size
16%
All-phase
16%
Analytical Data
16%
Free Surface
16%
Damage-free
16%
Polishing Process
16%
Mechanical Polishing
16%
Multiple Materials
16%
Minimum number
16%
Free Samples
16%
Solder Joint
16%
Cu Substrate
16%
Optimized Preparation
16%
Information Size
16%
Indexing Rate
16%
Pattern Quality
16%
Distortion-free
16%
Electron Backscatter Diffraction Pattern
16%
Wear Resistance Property
16%
Engineering
Joints (Structural Components)
100%
Free Solder
100%
Polishing Step
100%
Processing Parameter
50%
Sample Surface
50%
Free Surface
50%
Crystallographic Orientation
50%
Step Size α
50%
Wear Resistance
50%
Mechanical Polishing
50%
Multiple Material
50%
Resistance Property
50%
Specimen Preparation
50%
Material Science
Electron Backscatter Diffraction
100%
Lead-Free Solder
100%
Solder Joint
100%
Surface (Surface Science)
42%
Diffraction Pattern
28%
Tin
14%
Grain Size
14%
Wear Resistance
14%
Specimen Preparation
14%