Abstract
Metalorganic chemical vapor phase deposition of thick, crack-free GaN on Si can be performed either by patterning of the substrate and selective growth or by low-temperature (LT) AlN interlayers enabling very thick GaN layers. A reduction in dislocation density from 1010 to 109 cm-2 is observed for LT-AlN interlayers which can be further improved using monolayer thick SixNy in situ masking and subsequent lateral overgrowth. Crack-free AlGaN/GaN transistor structures show high room temperature mobilities of 1590 cm2/Vs at 6.7 × 1012cm-2 sheet carrier concentration. Thick crack-free light emitters have a maximum output power of 0.42 mW at 498 nm and 20 mA.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 556-562 |
| Number of pages | 7 |
| Journal | Journal of Crystal Growth |
| Volume | 248 |
| Issue number | SUPPL. |
| DOIs | |
| State | Published - Feb 2003 |
| Event | Proceedings of the eleventh international conference on MOVPE XI - Berlin, Germany Duration: Jun 3 2002 → Jun 7 2002 |
Keywords
- A1. Si(1 1 1) substrates
- A3. Metalorganic vapor phase epitaxy
- B1. GaN
ASJC Scopus subject areas
- Condensed Matter Physics
- Inorganic Chemistry
- Materials Chemistry
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