Abstract
The semiconductor device-based electronics industry has been the largest industry in the world with global sales of over a trillion dollars since 1998. The revolution in the semiconductor industry, a large portion of the electronics industry, began in 1947 with the fabrication of bipolar devices on slabs of polycrystalline germanium (Ge). Single-crystalline materials were later proposed and introduced that made possible the fabrication of grown junction transistors. Migration to silicon (Si)-based devices was initially hindered by the stability of the Si/SiO2 materials system, necessitating a new generation of crystal pullers with improved environmental controls to prevent SiO2 formation. Later, the stability and low interface-state density of the Si/SiO2 materials system provided passivation of junctions and eventually, the migration from bipolar devices to field-effect devices in 1960. By 1968, both complementary metal-oxide-semiconductor (CMOS) devices and poly-Si gate technology that allowed self-alignment of the gate to the source/drain of the device had been developed. These innovations permitted a significant reduction in power dissipation and a reduction of the overlap capacitance, improving frequency performance and resulting in the essential components of the modern CMOS device.
Original language | English (US) |
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Title of host publication | Handbook of Optoelectronic Device Modeling and Simulation |
Subtitle of host publication | Lasers, Modulators, Photodetectors, Solar Cells, and Numerical Methods |
Publisher | CRC Press |
Pages | 773-806 |
Number of pages | 34 |
Volume | 2 |
ISBN (Electronic) | 9781498749572 |
ISBN (Print) | 1498749569, 9781498749565 |
DOIs | |
State | Published - Jan 1 2017 |
ASJC Scopus subject areas
- General Engineering
- General Physics and Astronomy
- General Materials Science