Abstract
Modelling techniques are now routinely used to help understand the manufacturability and performance of conductive adhesives when used in electronic, photonic and microsystems packaging. This chapter reviews the latest advances of the techniques for structural and conductive adhesives.
| Original language | English (US) |
|---|---|
| Title of host publication | Advanced Adhesives in Electronics |
| Subtitle of host publication | Materials, Properties and Applications |
| Publisher | Elsevier Ltd. |
| Pages | 199-213 |
| Number of pages | 15 |
| ISBN (Electronic) | 9781845695767 |
| DOIs | |
| State | Published - Jan 1 2011 |
| Externally published | Yes |
Keywords
- Finite element analysis
- Optimisation
- Process modelling
ASJC Scopus subject areas
- General Engineering