Modelling Indium Interconnects for Ultra Fine-Pitch Focal Plane Arrays

Keyphrases

• 3D Stacking 20%
• Alignment Accuracy 20%
• Array Structure 20%
• Bonding Process 40%
• Bonding Technology 40%
• Chip Thickness 20%
• Cryogenic Temperature 20%
• Cycling Load 20%
• Die Structure 20%
• Equipment Placement 20%
• Finite Element Model 20%
• Flip-chip Bonding 20%
• Focal Plane Array 100%
• High Density 20%
• Indium 100%
• Indium Joints 40%
• Indium Solder 20%
• Infrared Detector 40%
• Infrared Sensor 20%
• Land Size 20%
• Pitch Size 20%
• Pixel Array 60%
• Placement Accuracy 20%
• Process Feasibility 20%
• Process Requirements 20%
• Readout Integrated Circuit 40%
• Reflow 60%
• Self-alignment 20%
• Sensor Bonding 20%
• Sensor Characteristics 20%
• Small pitch 20%
• Solder Interconnect 20%
• Stacked Die 20%
• Standoff 20%
• Temperature Cycling 20%
• Thermal Fatigue Damage 20%
• Thermo-compression Bonding 40%
• Thermomechanical Behavior 20%
• Ultra-fine pitch 100%
• Warpage 20%

Engineering

• Bonding Equipment 20%
• Bonding Process 40%
• Bonding Technology 40%
• Chip Bonding 20%
• Chip Thickness 20%
• Cryogenic Temperature 20%
• Die Structure 20%
• Fatigue Damage 20%
• Finite Element Modeling 20%
• Focal Plane 100%
• High Resolution 20%
• Infrared Sensor 20%
• Integrated Circuit 40%
• Interconnects 100%
• Joints (Structural Components) 40%
• Mechanical Property 20%
• Placement Accuracy 20%
• Process Requirement 20%
• Thermal Fatigue 20%