Methodology of reliability and power density analysis of SST topologies

Kuan Wang; Qin Lei; Chunhui Liu

doi:10.1109/APEC.2017.7930950

Methodology of reliability and power density analysis of SST topologies

Kuan Wang, Qin Lei, Chunhui Liu

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

7 Scopus citations

Abstract

This paper proposes a reliability analysis model and a power density analysis to evaluate the Solid-State Transformer(SST) topologies for different applications. The solid-state device rating and the redundancy number are considered as two major factors affecting the reliability. In each topology, the optimized selections of these two factors will be determined to reach sufficient reliability. The power density is influenced by the device volume, the transformer volume and the capacitor volume. In terms of these three aspects, the topology which has the highest power density is selected for the certain application. The effectiveness of the model is validated by the comparison between evaluation results and the actual industry products.

Original language	English (US)
Title of host publication	2017 IEEE Applied Power Electronics Conference and Exposition, APEC 2017
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	1851-1856
Number of pages	6
ISBN (Electronic)	9781509053667
DOIs	https://doi.org/10.1109/APEC.2017.7930950
State	Published - May 17 2017
Event	32nd Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2017 - Tampa, United States Duration: Mar 26 2017 → Mar 30 2017

Other

Other	32nd Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2017
Country/Territory	United States
City	Tampa
Period	3/26/17 → 3/30/17

ASJC Scopus subject areas

Electrical and Electronic Engineering

Access to Document

10.1109/APEC.2017.7930950

Cite this

Wang, K, Lei, Q & Liu, C 2017, Methodology of reliability and power density analysis of SST topologies. in 2017 IEEE Applied Power Electronics Conference and Exposition, APEC 2017., 7930950, Institute of Electrical and Electronics Engineers Inc., pp. 1851-1856, 32nd Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2017, Tampa, United States, 3/26/17. https://doi.org/10.1109/APEC.2017.7930950

@inproceedings{e7e69372a6e441b0938d6e74b1e876a8,

title = "Methodology of reliability and power density analysis of SST topologies",

abstract = "This paper proposes a reliability analysis model and a power density analysis to evaluate the Solid-State Transformer(SST) topologies for different applications. The solid-state device rating and the redundancy number are considered as two major factors affecting the reliability. In each topology, the optimized selections of these two factors will be determined to reach sufficient reliability. The power density is influenced by the device volume, the transformer volume and the capacitor volume. In terms of these three aspects, the topology which has the highest power density is selected for the certain application. The effectiveness of the model is validated by the comparison between evaluation results and the actual industry products.",

author = "Kuan Wang and Qin Lei and Chunhui Liu",

year = "2017",

month = may,

day = "17",

doi = "10.1109/APEC.2017.7930950",

language = "English (US)",

pages = "1851--1856",

booktitle = "2017 IEEE Applied Power Electronics Conference and Exposition, APEC 2017",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

address = "United States",

note = "32nd Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2017 ; Conference date: 26-03-2017 Through 30-03-2017",

}

TY - GEN

T1 - Methodology of reliability and power density analysis of SST topologies

AU - Wang, Kuan

AU - Lei, Qin

AU - Liu, Chunhui

PY - 2017/5/17

Y1 - 2017/5/17

N2 - This paper proposes a reliability analysis model and a power density analysis to evaluate the Solid-State Transformer(SST) topologies for different applications. The solid-state device rating and the redundancy number are considered as two major factors affecting the reliability. In each topology, the optimized selections of these two factors will be determined to reach sufficient reliability. The power density is influenced by the device volume, the transformer volume and the capacitor volume. In terms of these three aspects, the topology which has the highest power density is selected for the certain application. The effectiveness of the model is validated by the comparison between evaluation results and the actual industry products.

AB - This paper proposes a reliability analysis model and a power density analysis to evaluate the Solid-State Transformer(SST) topologies for different applications. The solid-state device rating and the redundancy number are considered as two major factors affecting the reliability. In each topology, the optimized selections of these two factors will be determined to reach sufficient reliability. The power density is influenced by the device volume, the transformer volume and the capacitor volume. In terms of these three aspects, the topology which has the highest power density is selected for the certain application. The effectiveness of the model is validated by the comparison between evaluation results and the actual industry products.

UR - http://www.scopus.com/inward/record.url?scp=85020066413&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85020066413&partnerID=8YFLogxK

U2 - 10.1109/APEC.2017.7930950

DO - 10.1109/APEC.2017.7930950

M3 - Conference contribution

AN - SCOPUS:85020066413

SP - 1851

EP - 1856

BT - 2017 IEEE Applied Power Electronics Conference and Exposition, APEC 2017

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 32nd Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2017

Y2 - 26 March 2017 through 30 March 2017

ER -

Methodology of reliability and power density analysis of SST topologies

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