Mechanical shock behavior of Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce solder joints

H. X. Xie, Nikhilesh Chawla

Research output: Contribution to journalArticlepeer-review

23 Scopus citations

Fingerprint

Dive into the research topics of 'Mechanical shock behavior of Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce solder joints'. Together they form a unique fingerprint.

Physics & Astronomy

Chemical Compounds

Engineering & Materials Science