Mechanical integrity of a carbon nanotube/copper-based through-silicon via for 3D integrated circuits: A multi-scale modeling approach

Keyphrases

• 3D IC 100%
• Adhesion Properties 20%
• Adhesion Zone 20%
• Carbon Nanotubes 100%
• Cohesive Zone Model 60%
• Composite Materials 20%
• Copper-based 100%
• Cu Interconnect 20%
• Cu-based 20%
• Cu-based Composites 20%
• Electrical Properties 20%
• Electromigration 20%
• Finite Element Analysis 20%
• Interface Adhesion 40%
• Loading Conditions 40%
• Mechanical Integrity 100%
• Mechanical Properties 20%
• Microelectronics Packaging 20%
• Miniaturization 20%
• Molecular Dynamics Simulation 40%
• Multiscale Modeling 100%
• Plastic Deformation 40%
• Thermal Cycling 20%
• Thermo-mechanical Loading 20%
• Thermomechanical Behavior 20%
• Through Silicon via 100%

Engineering

• Carbon Nanotube 100%
• Cohesive Zone Model 60%
• Composite Material 20%
• Copper (Cu) 20%
• Electromigration 20%
• Finite Element Analysis 20%
• Interconnects 20%
• Loading Condition 40%
• Mechanical Loading 20%
• Mechanical Property 20%
• Microelectronics 20%
• Microscale 20%
• Model Parameter 40%
• Multiscale Modeling 100%
• Nanoscale 20%
• Plastic Deformation 40%
• Three Dimensional Integrated Circuits 100%

Material Science

• Carbon Nanotube 100%
• Cohesive Zone Model 60%
• Composite Material 20%
• Electrical Property 20%
• Electronic Circuit 100%
• Finite Element Method 20%
• Mechanical Property 20%
• Multi-Scale Modeling 100%
• Plastic Deformation 40%
• Silicon 100%
• Thermal Cycling 20%