TY - JOUR
T1 - Mechanical characterization of lead-free Sn-Ag-Cu solder joints by high-temperature nanoindentation
AU - Lotfian, S.
AU - Molina-Aldareguia, J. M.
AU - Yazzie, K. E.
AU - Llorca, J.
AU - Chawla, Nikhilesh
N1 - Funding Information:
S.L., J.M.M.-A., and J.L. acknowledge the financial support of the Spanish Ministry of Science and Innovation (MAT2009-14396) and the Comunidad de Madrid through the program ESTRUMAT (S2009/MAT-1585). K.E.Y. and N.C. are grateful for the financial support for this work from the United States National Science Foundation Division of Materials Research–Metals Division (Drs. Alan Ardell, Bruce MacDonald, and Harsh Chopra, Program Directors).
PY - 2013/6
Y1 - 2013/6
N2 - The reliability of Pb-free solder joints is controlled by their microstructural constituents. Therefore, knowledge of the solder microconstituents' mechanical properties as a function of temperature is required. Sn-Ag-Cu lead-free solder alloy contains three phases: a Sn-rich phase, and the intermetallic compounds (IMCs) Cu6Sn5 and Ag3Sn. Typically, the Sn-rich phase is surrounded by a eutectic mixture of β-Sn, Cu6Sn5, and Ag3Sn. In this paper, we report on the Young's modulus and hardness of the Cu 6Sn5 and Cu3Sn IMCs, the β-Sn phase, and the eutectic compound, as measured by nanoindentation at elevated temperatures. For both the β-Sn phase and the eutectic compound, the hardness and Young's modulus exhibited strong temperature dependence. In the case of the intermetallics, this temperature dependence is observed for Cu 6Sn5, but the mechanical properties of Cu3Sn are more stable up to 200 C.
AB - The reliability of Pb-free solder joints is controlled by their microstructural constituents. Therefore, knowledge of the solder microconstituents' mechanical properties as a function of temperature is required. Sn-Ag-Cu lead-free solder alloy contains three phases: a Sn-rich phase, and the intermetallic compounds (IMCs) Cu6Sn5 and Ag3Sn. Typically, the Sn-rich phase is surrounded by a eutectic mixture of β-Sn, Cu6Sn5, and Ag3Sn. In this paper, we report on the Young's modulus and hardness of the Cu 6Sn5 and Cu3Sn IMCs, the β-Sn phase, and the eutectic compound, as measured by nanoindentation at elevated temperatures. For both the β-Sn phase and the eutectic compound, the hardness and Young's modulus exhibited strong temperature dependence. In the case of the intermetallics, this temperature dependence is observed for Cu 6Sn5, but the mechanical properties of Cu3Sn are more stable up to 200 C.
KW - High-temperature nanoindentation
KW - Sn-Ag-Cu solder
KW - intermetallics
KW - lead-free solder
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U2 - 10.1007/s11664-013-2517-z
DO - 10.1007/s11664-013-2517-z
M3 - Article
AN - SCOPUS:84877778037
SN - 0361-5235
VL - 42
SP - 1085
EP - 1091
JO - Journal of Electronic Materials
JF - Journal of Electronic Materials
IS - 6
ER -