Low-temperature amorphous-silicon backplane technology development for flexible displays in a manufacturing pilot-line environment

Gregory Raupp; Shawn M. O'Rourke; Curt Moyer; Barry P. O'Brien; Scott K. Ageno; Douglas E. Loy; Edward J. Bawolek; David Allee; Sameer M. Venugopal; Jann Kaminski; Dirk Bottesch; Jeff Dailey; Ke Long; Michael Marrs; Nick R. Munizza; Hanna Haverinen; Nicholas Colaneri

doi:10.1889/1.2759549

Low-temperature amorphous-silicon backplane technology development for flexible displays in a manufacturing pilot-line environment

Gregory Raupp
, Shawn M. O'Rourke
, Curt Moyer
, Barry P. O'Brien
, Scott K. Ageno
, Douglas E. Loy
, Edward J. Bawolek
, David Allee
, Sameer M. Venugopal
, Jann Kaminski
, Dirk Bottesch
, Jeff Dailey
, Ke Long
, Michael Marrs
, Nick R. Munizza
, Hanna Haverinen
, Nicholas Colaneri

Research output: Contribution to journal › Article › peer-review

55 Scopus citations

Abstract

A low-temperature amorphous-silicon (a-Si:H) thin-film-transistor (TFT) backplane technology for high-information-content flexible displays has been developed. Backplanes were integrated with frontplane technologies to produce high-performance active-matrix reflective electrophoretic ink, reflective cholesteric liquid crystal and emissive OLED flexible-display technology demonstrators (TDs). Backplanes up to 4 in. on the diagonal have been fabricated on a 6-in. wafer-scale pilot line. The critical steps in the evolution of backplane technology, from qualification of baseline low-temperature (180°C) a-Si:H process on the 6-in. line with rigid substrates, to transferring the process to flexible plastic and flexible stainless-steel substrates, to form factor scale-up of the TFT arrays, and finally manufacturing scale-up to a Gen 2 (370 × 470 mm) display-scale pilot line, will be reviewed.

Original language	English (US)
Pages (from-to)	445-454
Number of pages	10
Journal	Journal of the Society for Information Display
Volume	15
Issue number	7
DOIs	https://doi.org/10.1889/1.2759549
State	Published - Jul 2007

Keywords

Amorphous silicon
Backplane electronics
Flexible displays
Pilot-line manufacturing
Thin-film transistors

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Atomic and Molecular Physics, and Optics
Electrical and Electronic Engineering

Access to Document

10.1889/1.2759549

Cite this

Raupp, G., O'Rourke, S. M., Moyer, C., O'Brien, B. P., Ageno, S. K., Loy, D. E., Bawolek, E. J., Allee, D., Venugopal, S. M., Kaminski, J., Bottesch, D., Dailey, J., Long, K., Marrs, M., Munizza, N. R., Haverinen, H., & Colaneri, N. (2007). Low-temperature amorphous-silicon backplane technology development for flexible displays in a manufacturing pilot-line environment. Journal of the Society for Information Display, 15(7), 445-454. https://doi.org/10.1889/1.2759549

Raupp, G, O'Rourke, SM, Moyer, C, O'Brien, BP, Ageno, SK, Loy, DE, Bawolek, EJ, Allee, D, Venugopal, SM, Kaminski, J, Bottesch, D, Dailey, J, Long, K, Marrs, M, Munizza, NR, Haverinen, H & Colaneri, N 2007, 'Low-temperature amorphous-silicon backplane technology development for flexible displays in a manufacturing pilot-line environment', Journal of the Society for Information Display, vol. 15, no. 7, pp. 445-454. https://doi.org/10.1889/1.2759549

@article{7413c8e5cb7941c8ab34832d122714af,

title = "Low-temperature amorphous-silicon backplane technology development for flexible displays in a manufacturing pilot-line environment",

abstract = "A low-temperature amorphous-silicon (a-Si:H) thin-film-transistor (TFT) backplane technology for high-information-content flexible displays has been developed. Backplanes were integrated with frontplane technologies to produce high-performance active-matrix reflective electrophoretic ink, reflective cholesteric liquid crystal and emissive OLED flexible-display technology demonstrators (TDs). Backplanes up to 4 in. on the diagonal have been fabricated on a 6-in. wafer-scale pilot line. The critical steps in the evolution of backplane technology, from qualification of baseline low-temperature (180°C) a-Si:H process on the 6-in. line with rigid substrates, to transferring the process to flexible plastic and flexible stainless-steel substrates, to form factor scale-up of the TFT arrays, and finally manufacturing scale-up to a Gen 2 (370 × 470 mm) display-scale pilot line, will be reviewed.",

keywords = "Amorphous silicon, Backplane electronics, Flexible displays, Pilot-line manufacturing, Thin-film transistors",

author = "Gregory Raupp and O'Rourke, \{Shawn M.\} and Curt Moyer and O'Brien, \{Barry P.\} and Ageno, \{Scott K.\} and Loy, \{Douglas E.\} and Bawolek, \{Edward J.\} and David Allee and Venugopal, \{Sameer M.\} and Jann Kaminski and Dirk Bottesch and Jeff Dailey and Ke Long and Michael Marrs and Munizza, \{Nick R.\} and Hanna Haverinen and Nicholas Colaneri",

year = "2007",

month = jul,

doi = "10.1889/1.2759549",

language = "English (US)",

volume = "15",

pages = "445--454",

journal = "Journal of the Society for Information Display",

issn = "1071-0922",

publisher = "John Wiley and Sons Inc.",

number = "7",

}

TY - JOUR

T1 - Low-temperature amorphous-silicon backplane technology development for flexible displays in a manufacturing pilot-line environment

AU - Raupp, Gregory

AU - O'Rourke, Shawn M.

AU - Moyer, Curt

AU - O'Brien, Barry P.

AU - Ageno, Scott K.

AU - Loy, Douglas E.

AU - Bawolek, Edward J.

AU - Allee, David

AU - Venugopal, Sameer M.

AU - Kaminski, Jann

AU - Bottesch, Dirk

AU - Dailey, Jeff

AU - Long, Ke

AU - Marrs, Michael

AU - Munizza, Nick R.

AU - Haverinen, Hanna

AU - Colaneri, Nicholas

PY - 2007/7

Y1 - 2007/7

N2 - A low-temperature amorphous-silicon (a-Si:H) thin-film-transistor (TFT) backplane technology for high-information-content flexible displays has been developed. Backplanes were integrated with frontplane technologies to produce high-performance active-matrix reflective electrophoretic ink, reflective cholesteric liquid crystal and emissive OLED flexible-display technology demonstrators (TDs). Backplanes up to 4 in. on the diagonal have been fabricated on a 6-in. wafer-scale pilot line. The critical steps in the evolution of backplane technology, from qualification of baseline low-temperature (180°C) a-Si:H process on the 6-in. line with rigid substrates, to transferring the process to flexible plastic and flexible stainless-steel substrates, to form factor scale-up of the TFT arrays, and finally manufacturing scale-up to a Gen 2 (370 × 470 mm) display-scale pilot line, will be reviewed.

AB - A low-temperature amorphous-silicon (a-Si:H) thin-film-transistor (TFT) backplane technology for high-information-content flexible displays has been developed. Backplanes were integrated with frontplane technologies to produce high-performance active-matrix reflective electrophoretic ink, reflective cholesteric liquid crystal and emissive OLED flexible-display technology demonstrators (TDs). Backplanes up to 4 in. on the diagonal have been fabricated on a 6-in. wafer-scale pilot line. The critical steps in the evolution of backplane technology, from qualification of baseline low-temperature (180°C) a-Si:H process on the 6-in. line with rigid substrates, to transferring the process to flexible plastic and flexible stainless-steel substrates, to form factor scale-up of the TFT arrays, and finally manufacturing scale-up to a Gen 2 (370 × 470 mm) display-scale pilot line, will be reviewed.

KW - Amorphous silicon

KW - Backplane electronics

KW - Flexible displays

KW - Pilot-line manufacturing

KW - Thin-film transistors

UR - https://www.scopus.com/pages/publications/46749126591

UR - https://www.scopus.com/pages/publications/46749126591#tab=citedBy

U2 - 10.1889/1.2759549

DO - 10.1889/1.2759549

M3 - Article

AN - SCOPUS:46749126591

SN - 1071-0922

VL - 15

SP - 445

EP - 454

JO - Journal of the Society for Information Display

JF - Journal of the Society for Information Display

IS - 7

ER -

Low-temperature amorphous-silicon backplane technology development for flexible displays in a manufacturing pilot-line environment

Abstract

Keywords

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this