Localized Pulsed Electrodeposition Process for Three-Dimensional Printing of Nanotwinned Metallic Nanostructures

Soheil Daryadel; Ali Behroozfar; S. Reza Morsali; Salvador Moreno; Mahmoud Baniasadi; Julia Bykova; Rodrigo A. Bernal; Majid Minary-Jolandan

doi:10.1021/acs.nanolett.7b03930

Localized Pulsed Electrodeposition Process for Three-Dimensional Printing of Nanotwinned Metallic Nanostructures

Soheil Daryadel, Ali Behroozfar, S. Reza Morsali, Salvador Moreno, Mahmoud Baniasadi, Julia Bykova, Rodrigo A. Bernal, Majid Minary-Jolandan

Research output: Contribution to journal › Article › peer-review

64 Scopus citations

Abstract

Nanotwinned-metals (nt-metals) offer superior mechanical (high ductility and strength) and electrical (low electromigration) properties compared to their nanocrystalline (nc) counterparts. These properties are advantageous in particular for applications in nanoscale devices. However, fabrication of nt-metals has been limited to films (two-dimensional) or template-based (one-dimensional) geometries, using various chemical and physical processes. In this Letter, we demonstrate the ambient environment localized pulsed electrodeposition process for direct printing of three-dimensional (3D) freestanding nanotwinned-Copper (nt-Cu) nanostructures. 3D nt-Cu structures were additively manufactured using pulsed electrodeposition at the tip of an electrolyte-containing nozzle. Focused ion beam (FIB) and transmission electron microscopy (TEM) analysis revealed that the printed metal was fully dense, and was mostly devoid of impurities and microstructural defects. FIB and TEM images also revealed nanocrystalline-nanotwinned-microstructure (nc-nt-microstructure), and confirmed the formation of coherent twin boundaries in the 3D-printed Cu. Mechanical properties of the 3D-printed nc-nt-Cu were characterized by direct printing (FIB-less) of micropillars for in situ SEM microcompression experiments. The 3D-printed nc-nt-Cu exhibited a flow stress of over 960 MPa, among the highest ever reported, which is remarkable for a 3D-printed material. The microstructure and mechanical properties of the nc-nt-Cu were compared to those of nc-Cu printed using the same process under direct current (DC) voltage.

Original language	English (US)
Pages (from-to)	208-214
Number of pages	7
Journal	Nano Letters
Volume	18
Issue number	1
DOIs	https://doi.org/10.1021/acs.nanolett.7b03930
State	Published - Jan 10 2018
Externally published	Yes

Keywords

3D printing
in situ SEM microcompression
localized pulsed electrodeposition (L-PED)
mechanical properties
Nanotwinned-Cu

ASJC Scopus subject areas

Bioengineering
Chemistry(all)
Materials Science(all)
Condensed Matter Physics
Mechanical Engineering

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10.1021/acs.nanolett.7b03930

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title = "Localized Pulsed Electrodeposition Process for Three-Dimensional Printing of Nanotwinned Metallic Nanostructures",

abstract = "Nanotwinned-metals (nt-metals) offer superior mechanical (high ductility and strength) and electrical (low electromigration) properties compared to their nanocrystalline (nc) counterparts. These properties are advantageous in particular for applications in nanoscale devices. However, fabrication of nt-metals has been limited to films (two-dimensional) or template-based (one-dimensional) geometries, using various chemical and physical processes. In this Letter, we demonstrate the ambient environment localized pulsed electrodeposition process for direct printing of three-dimensional (3D) freestanding nanotwinned-Copper (nt-Cu) nanostructures. 3D nt-Cu structures were additively manufactured using pulsed electrodeposition at the tip of an electrolyte-containing nozzle. Focused ion beam (FIB) and transmission electron microscopy (TEM) analysis revealed that the printed metal was fully dense, and was mostly devoid of impurities and microstructural defects. FIB and TEM images also revealed nanocrystalline-nanotwinned-microstructure (nc-nt-microstructure), and confirmed the formation of coherent twin boundaries in the 3D-printed Cu. Mechanical properties of the 3D-printed nc-nt-Cu were characterized by direct printing (FIB-less) of micropillars for in situ SEM microcompression experiments. The 3D-printed nc-nt-Cu exhibited a flow stress of over 960 MPa, among the highest ever reported, which is remarkable for a 3D-printed material. The microstructure and mechanical properties of the nc-nt-Cu were compared to those of nc-Cu printed using the same process under direct current (DC) voltage.",

keywords = "3D printing, in situ SEM microcompression, localized pulsed electrodeposition (L-PED), mechanical properties, Nanotwinned-Cu",

author = "Soheil Daryadel and Ali Behroozfar and Morsali, {S. Reza} and Salvador Moreno and Mahmoud Baniasadi and Julia Bykova and Bernal, {Rodrigo A.} and Majid Minary-Jolandan",

note = "Funding Information: This work is supported by the US Office of Naval Research Young Investigator Program (Award No. N00014-15-1-2795), within the Manufacturing Science Program (Program manager, Dr. Richard Fonda). The authors would like to thank Dr. Hyunjoo Choi, and Seungjin Nam from the School of Advanced Materials Engineering of Kookmin University, and Luhua Wang, and Qingxiao Wang from the Department of Materials Science and Engineering at the University of Texas at Dallas for assistance with the characterization. Publisher Copyright: {\textcopyright} 2017 American Chemical Society.",

year = "2018",

month = jan,

day = "10",

doi = "10.1021/acs.nanolett.7b03930",

language = "English (US)",

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journal = "Nano Letters",

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T1 - Localized Pulsed Electrodeposition Process for Three-Dimensional Printing of Nanotwinned Metallic Nanostructures

AU - Daryadel, Soheil

AU - Behroozfar, Ali

AU - Morsali, S. Reza

AU - Moreno, Salvador

AU - Baniasadi, Mahmoud

AU - Bykova, Julia

AU - Bernal, Rodrigo A.

AU - Minary-Jolandan, Majid

N1 - Funding Information: This work is supported by the US Office of Naval Research Young Investigator Program (Award No. N00014-15-1-2795), within the Manufacturing Science Program (Program manager, Dr. Richard Fonda). The authors would like to thank Dr. Hyunjoo Choi, and Seungjin Nam from the School of Advanced Materials Engineering of Kookmin University, and Luhua Wang, and Qingxiao Wang from the Department of Materials Science and Engineering at the University of Texas at Dallas for assistance with the characterization. Publisher Copyright: © 2017 American Chemical Society.

PY - 2018/1/10

Y1 - 2018/1/10

N2 - Nanotwinned-metals (nt-metals) offer superior mechanical (high ductility and strength) and electrical (low electromigration) properties compared to their nanocrystalline (nc) counterparts. These properties are advantageous in particular for applications in nanoscale devices. However, fabrication of nt-metals has been limited to films (two-dimensional) or template-based (one-dimensional) geometries, using various chemical and physical processes. In this Letter, we demonstrate the ambient environment localized pulsed electrodeposition process for direct printing of three-dimensional (3D) freestanding nanotwinned-Copper (nt-Cu) nanostructures. 3D nt-Cu structures were additively manufactured using pulsed electrodeposition at the tip of an electrolyte-containing nozzle. Focused ion beam (FIB) and transmission electron microscopy (TEM) analysis revealed that the printed metal was fully dense, and was mostly devoid of impurities and microstructural defects. FIB and TEM images also revealed nanocrystalline-nanotwinned-microstructure (nc-nt-microstructure), and confirmed the formation of coherent twin boundaries in the 3D-printed Cu. Mechanical properties of the 3D-printed nc-nt-Cu were characterized by direct printing (FIB-less) of micropillars for in situ SEM microcompression experiments. The 3D-printed nc-nt-Cu exhibited a flow stress of over 960 MPa, among the highest ever reported, which is remarkable for a 3D-printed material. The microstructure and mechanical properties of the nc-nt-Cu were compared to those of nc-Cu printed using the same process under direct current (DC) voltage.

AB - Nanotwinned-metals (nt-metals) offer superior mechanical (high ductility and strength) and electrical (low electromigration) properties compared to their nanocrystalline (nc) counterparts. These properties are advantageous in particular for applications in nanoscale devices. However, fabrication of nt-metals has been limited to films (two-dimensional) or template-based (one-dimensional) geometries, using various chemical and physical processes. In this Letter, we demonstrate the ambient environment localized pulsed electrodeposition process for direct printing of three-dimensional (3D) freestanding nanotwinned-Copper (nt-Cu) nanostructures. 3D nt-Cu structures were additively manufactured using pulsed electrodeposition at the tip of an electrolyte-containing nozzle. Focused ion beam (FIB) and transmission electron microscopy (TEM) analysis revealed that the printed metal was fully dense, and was mostly devoid of impurities and microstructural defects. FIB and TEM images also revealed nanocrystalline-nanotwinned-microstructure (nc-nt-microstructure), and confirmed the formation of coherent twin boundaries in the 3D-printed Cu. Mechanical properties of the 3D-printed nc-nt-Cu were characterized by direct printing (FIB-less) of micropillars for in situ SEM microcompression experiments. The 3D-printed nc-nt-Cu exhibited a flow stress of over 960 MPa, among the highest ever reported, which is remarkable for a 3D-printed material. The microstructure and mechanical properties of the nc-nt-Cu were compared to those of nc-Cu printed using the same process under direct current (DC) voltage.

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Localized Pulsed Electrodeposition Process for Three-Dimensional Printing of Nanotwinned Metallic Nanostructures

Abstract

Keywords

ASJC Scopus subject areas

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