Abstract
A hierarchical two-dimensional field solution technique is introduced for capacitance extraction for VLSI interconnect modeling. As a basis for compromise between the efficiency of Boolean rules-based extraction and the accuracy of flat field solution, this hierarchical approach can handle realistic conductor cross-sections and multiple conformal and/or planarized dielectrics.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 127-132 |
| Number of pages | 6 |
| Journal | Proceedings - Design Automation Conference |
| DOIs | |
| State | Published - 1997 |
| Externally published | Yes |
| Event | Proceedings of the 1997 34th Design Automation Conference - Anaheim, CA, USA Duration: Jun 9 1997 → Jun 13 1997 |
ASJC Scopus subject areas
- Hardware and Architecture
- Control and Systems Engineering
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