TY - GEN
T1 - Graph Neural Network-based Delay-Fault Localization for Monolithic 3D ICs
AU - Hung, Shao Chun
AU - Banerjee, Sanmitra
AU - Chaudhuri, Arjun
AU - Chakrabarty, Krishnendu
N1 - Publisher Copyright:
© 2022 EDAA.
PY - 2022
Y1 - 2022
N2 - Monolithic 3D (M3D) integration is a promising technology for achieving high performance and low power consumption. However, the limitations of current M3D fabrication flows lead to performance degradation of devices in the top tier and unreliable interconnects between tiers. Fault localization at the tier level is therefore necessary to enhance yield learning, For example, tier-level localization can enable targeted diagnosis and process optimization efforts. In this paper, we develop a graph neural network-based diagnosis framework to efficiently localize faults to a device tier. The proposed framework can be used to provide rapid feedback to the foundry and help enhance the quality of diagnosis reports generated by commercial tools. Results for four M3D benchmarks, with and without response compaction, show that the proposed solution achieves up to 39.19% improvement in diagnostic resolution with less than 1% loss of accuracy, compared to results from commercial tools.
AB - Monolithic 3D (M3D) integration is a promising technology for achieving high performance and low power consumption. However, the limitations of current M3D fabrication flows lead to performance degradation of devices in the top tier and unreliable interconnects between tiers. Fault localization at the tier level is therefore necessary to enhance yield learning, For example, tier-level localization can enable targeted diagnosis and process optimization efforts. In this paper, we develop a graph neural network-based diagnosis framework to efficiently localize faults to a device tier. The proposed framework can be used to provide rapid feedback to the foundry and help enhance the quality of diagnosis reports generated by commercial tools. Results for four M3D benchmarks, with and without response compaction, show that the proposed solution achieves up to 39.19% improvement in diagnostic resolution with less than 1% loss of accuracy, compared to results from commercial tools.
UR - http://www.scopus.com/inward/record.url?scp=85130853351&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85130853351&partnerID=8YFLogxK
U2 - 10.23919/DATE54114.2022.9774511
DO - 10.23919/DATE54114.2022.9774511
M3 - Conference contribution
AN - SCOPUS:85130853351
T3 - Proceedings of the 2022 Design, Automation and Test in Europe Conference and Exhibition, DATE 2022
SP - 448
EP - 453
BT - Proceedings of the 2022 Design, Automation and Test in Europe Conference and Exhibition, DATE 2022
A2 - Bolchini, Cristiana
A2 - Verbauwhede, Ingrid
A2 - Vatajelu, Ioana
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2022 Design, Automation and Test in Europe Conference and Exhibition, DATE 2022
Y2 - 14 March 2022 through 23 March 2022
ER -