Fabrication and characterization of a wafer-level MEMS vacuum package with vertical feedthroughs

Junseok Chae, Joseph M. Giachino, Khalil Najafi

Research output: Contribution to journalArticlepeer-review

68 Scopus citations


This paper reports a MEMS vacuum package with vertical feedthroughs formed in a glass substrate all at the wafer level. This approach satisfies requirements for MEMS vacuum packages, including small size, vacuum/hermetic capability, sealed and low parasitic feedthroughs, wafer-level processing, compatibility with most MEMS processes, and low cost. It also enables flip-chip solder attachment to a PC board. The package has an integrated micro-Pirani gauge on a glass substrate for in situ monitoring, a silicon cap, and vertical feedthroughs through the glass. The integrated Pirani gauge has 0.6 milli-torr resolution at 0.1 torr and 0.2 torr resolution at 100 torr. Using the Pirani gauge, the fabricated vacuum package is characterized. The package has maintained ∼33 torr base pressure with ±1.5 torr uncertainty for more than four months without a getter. The long-term measured pressure uncertainty is from the measurement setup and environment, and can be improved using a getter inside the package.

Original languageEnglish (US)
Pages (from-to)193-200
Number of pages8
JournalJournal of Microelectromechanical Systems
Issue number1
StatePublished - Feb 2008


  • Package
  • Pirani
  • Vacuum
  • Vertical feedthrough

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering


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