Emerging flexible hybrid electronics paradigm integrates traditional rigid integrated circuits and printed electronics on a flexible substrate. This hybrid approach aims to combine the physical benefits of flexible electronics with the computational advantages of the silicon technology. In this paper, we discuss the possibility to implement a physically flexible system capable of sensing, computation and communication. We argue that this capability can transform personalized computing by enabling the next big leap forward in the form factor design, similar to the shift from desktop and laptop computers to hand-held devices. Designing this type of a comprehensive system requires integrating many flexible and rigid resources on the same substrate. As a result, efficient interconnection network design rises as one of the major challenges similar to the system-on-chip experience. Therefore, we also discuss the interconnect design challenges and promising solutions for flexible hybrid systems.
|Title of host publication
|2016 10th IEEE/ACM International Symposium on Networks-on-Chip, NOCS 2016
|Institute of Electrical and Electronics Engineers Inc.
|Published - Sep 28 2016
|10th IEEE/ACM International Symposium on Networks-on-Chip, NOCS 2016 - Nara, Japan
Duration: Aug 31 2016 → Sep 2 2016
|10th IEEE/ACM International Symposium on Networks-on-Chip, NOCS 2016
|8/31/16 → 9/2/16
- Flexible Electronics
- Flexible Hybrid Electronics
- Thin-Film Transistor (TFT)
ASJC Scopus subject areas
- Computer Networks and Communications
- Hardware and Architecture