Abstract
In this study Cu films of 30 nm and 200 nm thickness have been grown on natural type IIb semiconducting diamond C(001) substrates by electron-beam evaporation at 500 °C in UHV. As evidenced by Rutherford backscattering/channeling techniques and in situ low-energy electron diffraction, the as-deposited layers were shown to be epitaxial, with χCu = 49%. In addition, the technique of atomic force microscopy has demonstrated island morphology, indicative of three-dimensional growth. Moreover, the Cu films displayed excellent adhesion properties with the underlying diamond substrate. Corresponding current-voltage (I-V) measurements conducted at room temperature have shown rectifying characteristics. In addition, a Schottky barrier height of ΦB ≈ 1.1 eV has been determined from ultraviolet photoemission spectroscopy.
Original language | English (US) |
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Pages (from-to) | 883-886 |
Number of pages | 4 |
Journal | Diamond and Related Materials |
Volume | 3 |
Issue number | 4-6 |
DOIs | |
State | Published - Apr 1994 |
Externally published | Yes |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Mechanical Engineering
- Physics and Astronomy(all)
- Materials Chemistry
- Chemistry(all)
- Electrical and Electronic Engineering