Electrodeposition of Ni3S2 with significantly improved uniformity and adhesion to F-doped SnO2 substrate is reported. Ni3S2 films of about 1 μm thickness were deposited from an aqueous solution containing NiSO4, Na 2S2O3 and gelatin. Gelatin is found to stabilize the size of colloidal sulfur to ∼260 nm, keeping the electroactive sulfur concentration stable during the deposition. Other deposition parameters such as NiSO4 concentration, bath temperature and deposition potential are found to have a profound effect on film morphology and adhesion. Ni3S2 films with a uniform composition across the entire substrate can be deposited from a solution containing 0.013M NiSO4, 0.5M Na2S2O3, 8.8×10-4 wt% gelatin at 60°C temperature, pH 4.7 and -0.4V deposition potential.