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Effects of cooling rate on creep behavior of a Sn-3.5Ag alloy
F. Ochoa, X. Deng, Nikhilesh Chawla
Chemical Engineering
Research output
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Contribution to journal
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Article
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peer-review
107
Scopus citations
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Dive into the research topics of 'Effects of cooling rate on creep behavior of a Sn-3.5Ag alloy'. Together they form a unique fingerprint.
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Chemical Compounds
Creep Behavior
100%
Cooling
58%
Alloy
46%
Solder
25%
Microstructure
13%
Grain Boundary
10%
Eutectics
10%
Creep Strength
8%
Creep
6%
Atomic Force Microscopy
4%
Strain
3%
Reaction Activation Energy
3%
Diffusion
3%
Scanning Electron Microscopy
3%
Engineering & Materials Science
Creep
56%
Cooling
45%
Soldering alloys
19%
Grain boundary sliding
14%
Microstructure
13%
Dendrites (metallography)
11%
Eutectics
10%
Atomic force microscopy
6%
Activation energy
5%
Furnaces
4%
Scanning electron microscopy
4%
Pipe
3%
Air
2%
Water
2%
Physics & Astronomy
cooling
44%
solders
22%
microstructure
11%
dendrites
10%
eutectics
9%
sliding
9%
grain boundaries
7%
creep strength
6%
furnaces
4%
atomic force microscopy
3%
exponents
3%
activation energy
3%
scanning electron microscopy
3%
air
3%
water
2%