Effect of design variables on voids and thermal performance of QFN packages

Farbod Askari; Leila Jannesari Ladani; Abhijit Dasgupta; Matti Rahko; Jussi Sarkka

doi:10.1115/HT2007-32067

Effect of design variables on voids and thermal performance of QFN packages

Farbod Askari
, Leila Jannesari Ladani
, Abhijit Dasgupta
, Matti Rahko
, Jussi Sarkka

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

The objective of this study is to empirically investigate the dependence of solder voids and related interconnect defects in QFN packages, on such design variables as stencil aperture pattern and size, as well as quantity and location of thermal vias. A non-traditional fractional-factorial matrix was used for this study. The QFN packages produced by implementing this experiment were analyzed using destructive and non-destructive failure analysis techniques. The effect of design variables on different types of defects such as voids, and taper were evaluated. This study showed that stencil aperture size influences void area percentage the most in comparison with other design variables. An optimal stencil configuration was proposed based on void area fraction calculations. A 2-D steady-state finite element analysis was then conducted to parametrically evaluate the effect of solder voids on the performance of thermal vias under QFN thermal pads. The model confirmed that the performance of thermal vias is not very sensitive to void area fraction.

Original language	English (US)
Title of host publication	2007 Proceedings of the ASME/JSME Thermal Engineering Summer Heat Transfer Conference - HT 2007
Pages	705-712
Number of pages	8
DOIs	https://doi.org/10.1115/HT2007-32067
State	Published - 2007
Externally published	Yes
Event	2007 ASME/JSME Thermal Engineering Summer Heat Transfer Conference, HT 2007 - Vancouver, BC, Canada Duration: Jul 8 2007 → Jul 12 2007

Publication series

Name	2007 Proceedings of the ASME/JSME Thermal Engineering Summer Heat Transfer Conference - HT 2007
Volume	2

Conference

Conference	2007 ASME/JSME Thermal Engineering Summer Heat Transfer Conference, HT 2007
Country/Territory	Canada
City	Vancouver, BC
Period	7/8/07 → 7/12/07

Keywords

FEA
Parametric studies
QFN
Solder voids
Stencil design
Thermal performance
Thermal vias

ASJC Scopus subject areas

Electrical and Electronic Engineering
Mechanical Engineering
Condensed Matter Physics

Access to Document

10.1115/HT2007-32067

Cite this

Askari, F., Ladani, L. J., Dasgupta, A., Rahko, M., & Sarkka, J. (2007). Effect of design variables on voids and thermal performance of QFN packages. In 2007 Proceedings of the ASME/JSME Thermal Engineering Summer Heat Transfer Conference - HT 2007 (pp. 705-712). (2007 Proceedings of the ASME/JSME Thermal Engineering Summer Heat Transfer Conference - HT 2007; Vol. 2). https://doi.org/10.1115/HT2007-32067

Effect of design variables on voids and thermal performance of QFN packages. / Askari, Farbod; Ladani, Leila Jannesari; Dasgupta, Abhijit et al.
2007 Proceedings of the ASME/JSME Thermal Engineering Summer Heat Transfer Conference - HT 2007. 2007. p. 705-712 (2007 Proceedings of the ASME/JSME Thermal Engineering Summer Heat Transfer Conference - HT 2007; Vol. 2).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Askari, F, Ladani, LJ, Dasgupta, A, Rahko, M & Sarkka, J 2007, Effect of design variables on voids and thermal performance of QFN packages. in 2007 Proceedings of the ASME/JSME Thermal Engineering Summer Heat Transfer Conference - HT 2007. 2007 Proceedings of the ASME/JSME Thermal Engineering Summer Heat Transfer Conference - HT 2007, vol. 2, pp. 705-712, 2007 ASME/JSME Thermal Engineering Summer Heat Transfer Conference, HT 2007, Vancouver, BC, Canada, 7/8/07. https://doi.org/10.1115/HT2007-32067

Askari F, Ladani LJ, Dasgupta A, Rahko M, Sarkka J. Effect of design variables on voids and thermal performance of QFN packages. In 2007 Proceedings of the ASME/JSME Thermal Engineering Summer Heat Transfer Conference - HT 2007. 2007. p. 705-712. (2007 Proceedings of the ASME/JSME Thermal Engineering Summer Heat Transfer Conference - HT 2007). doi: 10.1115/HT2007-32067

@inproceedings{b2d34f2d046244da8a21601be0ca6b8c,

title = "Effect of design variables on voids and thermal performance of QFN packages",

abstract = "The objective of this study is to empirically investigate the dependence of solder voids and related interconnect defects in QFN packages, on such design variables as stencil aperture pattern and size, as well as quantity and location of thermal vias. A non-traditional fractional-factorial matrix was used for this study. The QFN packages produced by implementing this experiment were analyzed using destructive and non-destructive failure analysis techniques. The effect of design variables on different types of defects such as voids, and taper were evaluated. This study showed that stencil aperture size influences void area percentage the most in comparison with other design variables. An optimal stencil configuration was proposed based on void area fraction calculations. A 2-D steady-state finite element analysis was then conducted to parametrically evaluate the effect of solder voids on the performance of thermal vias under QFN thermal pads. The model confirmed that the performance of thermal vias is not very sensitive to void area fraction.",

keywords = "FEA, Parametric studies, QFN, Solder voids, Stencil design, Thermal performance, Thermal vias",

author = "Farbod Askari and Ladani, \{Leila Jannesari\} and Abhijit Dasgupta and Matti Rahko and Jussi Sarkka",

year = "2007",

doi = "10.1115/HT2007-32067",

language = "English (US)",

isbn = "0791842746",

series = "2007 Proceedings of the ASME/JSME Thermal Engineering Summer Heat Transfer Conference - HT 2007",

pages = "705--712",

booktitle = "2007 Proceedings of the ASME/JSME Thermal Engineering Summer Heat Transfer Conference - HT 2007",

}

TY - GEN

T1 - Effect of design variables on voids and thermal performance of QFN packages

AU - Askari, Farbod

AU - Ladani, Leila Jannesari

AU - Dasgupta, Abhijit

AU - Rahko, Matti

AU - Sarkka, Jussi

PY - 2007

Y1 - 2007

N2 - The objective of this study is to empirically investigate the dependence of solder voids and related interconnect defects in QFN packages, on such design variables as stencil aperture pattern and size, as well as quantity and location of thermal vias. A non-traditional fractional-factorial matrix was used for this study. The QFN packages produced by implementing this experiment were analyzed using destructive and non-destructive failure analysis techniques. The effect of design variables on different types of defects such as voids, and taper were evaluated. This study showed that stencil aperture size influences void area percentage the most in comparison with other design variables. An optimal stencil configuration was proposed based on void area fraction calculations. A 2-D steady-state finite element analysis was then conducted to parametrically evaluate the effect of solder voids on the performance of thermal vias under QFN thermal pads. The model confirmed that the performance of thermal vias is not very sensitive to void area fraction.

AB - The objective of this study is to empirically investigate the dependence of solder voids and related interconnect defects in QFN packages, on such design variables as stencil aperture pattern and size, as well as quantity and location of thermal vias. A non-traditional fractional-factorial matrix was used for this study. The QFN packages produced by implementing this experiment were analyzed using destructive and non-destructive failure analysis techniques. The effect of design variables on different types of defects such as voids, and taper were evaluated. This study showed that stencil aperture size influences void area percentage the most in comparison with other design variables. An optimal stencil configuration was proposed based on void area fraction calculations. A 2-D steady-state finite element analysis was then conducted to parametrically evaluate the effect of solder voids on the performance of thermal vias under QFN thermal pads. The model confirmed that the performance of thermal vias is not very sensitive to void area fraction.

KW - FEA

KW - Parametric studies

KW - QFN

KW - Solder voids

KW - Stencil design

KW - Thermal performance

KW - Thermal vias

UR - https://www.scopus.com/pages/publications/43449128412

UR - https://www.scopus.com/pages/publications/43449128412#tab=citedBy

U2 - 10.1115/HT2007-32067

DO - 10.1115/HT2007-32067

M3 - Conference contribution

AN - SCOPUS:43449128412

SN - 0791842746

SN - 9780791842744

T3 - 2007 Proceedings of the ASME/JSME Thermal Engineering Summer Heat Transfer Conference - HT 2007

SP - 705

EP - 712

BT - 2007 Proceedings of the ASME/JSME Thermal Engineering Summer Heat Transfer Conference - HT 2007

T2 - 2007 ASME/JSME Thermal Engineering Summer Heat Transfer Conference, HT 2007

Y2 - 8 July 2007 through 12 July 2007

ER -

Effect of design variables on voids and thermal performance of QFN packages

Abstract

Publication series

Conference

Keywords

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this