Direct metal nano-patterning using embossed solid electrolyte

Anil Kumar, Keng Hsu, Kyle Jacobs, Placid Ferreira, Nicholas Fang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations


In this letter we introduce a new approach to fabricating nano-scale metallic features by combining best merits of micro-forming, nanoimprint lithography, and electrochemical nanoimprinting. We study the mechanical properties of Ag2S, a solid-state superionic conductor previously reported by Hsu et al. [1] for electrochemical nanoimprinting (S4 process), and explore its capability for embossing using a Si mold fabricated using electron-beam lithography. By circumventing the traditional route of stamp preparation using Focused Ion Beam (FIB), we greatly enhance the capability of electrochemical nanoimprinting. Using an embossed stamp, we demonstrate features <10 nm; and patterns on areas >30 mm2. Application of an embossed Ag2S stamp is a significant step towards extending the S4 process for direct metal patterning of features beyond the capability of current processes.

Original languageEnglish (US)
Title of host publicationMaterials, Processes, and Reliability for Advanced Interconnects for Micro- and Nanoelectronics - 2009
PublisherMaterials Research Society
Number of pages6
ISBN (Print)9781605111292, 9781605111643
StatePublished - 2009
Event2009 MRS Spring Meeting - San Francisco, CA, United States
Duration: Apr 13 2009Apr 17 2009

Publication series

NameMaterials Research Society Symposium Proceedings
ISSN (Print)0272-9172


Other2009 MRS Spring Meeting
Country/TerritoryUnited States
CitySan Francisco, CA

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering


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