Keyphrases
Seed Layer
100%
Microelectronics Applications
100%
High Temperature Resistant
100%
Copper Electrodeposition
100%
Carbon Nanotubes
44%
High Temperature
33%
Silicon Wafer
33%
Electroplating
33%
Nichrome
33%
Microelectronics
22%
Graphene
22%
Two Dimensional Materials
22%
Barrier Layer
22%
Chemical Vapor Deposition
22%
Copper Electroplating
22%
Carbon Nanotube Growth
22%
Copper Deposition
22%
Silver Seeds
22%
Adhesion
11%
High Resistance
11%
Elevated Temperature
11%
Material Limits
11%
Scanning Electron Microscope
11%
Elemental Mapping
11%
Microfabrication
11%
Silicon Layer
11%
Physical Vapor Deposition
11%
Copper Interconnect
11%
Transition Metal Dichalcogenides
11%
Graphene-carbon Nanotubes
11%
Used Material
11%
Carbon Transitions
11%
Vertically Aligned Carbon Nanotubes (VACNTs)
11%
Electromigration Resistance
11%
Adhesion Layer
11%
Microscopic Examination
11%
Transition Metal Dichalcogenide Materials
11%
Copper Coating
11%
Digital Microscope
11%
Engineering
Microelectronics
100%
Seed Layer
100%
Carbon Nanotube
88%
Nanoscale
44%
Graphene
33%
Silicon Wafer
33%
Interconnects
33%
2D Material
22%
Chemical Vapor Deposition
22%
Vapor Deposition
22%
Transition Metal Dichalcogenide
22%
Barrier Layer
22%
Limitations
11%
Conductive
11%
Elevated Temperature
11%
Electromigration
11%
Late Stage
11%
Microfabrication
11%
Physical Vapor Deposition
11%
Silicon Layer
11%
Adhesion Layer
11%
Microelectronic Processing
11%
Scanning Electron Microscope
11%
Material Science
Carbon Nanotube
100%
Electrodeposition
100%
Silver
50%
Electroplating
50%
Silicon
37%
Graphene
37%
Silicon Wafer
37%
Platinum
37%
Nichrome
37%
Two-Dimensional Material
25%
Chemical Vapor Deposition
25%
Transition Metal Dichalcogenide
25%
Scanning Electron Microscopy
12%
Microscopy
12%
Microfabrication
12%
Physical Vapor Deposition
12%
Composite Material
12%