Design for reliability for wafer level system in package

Stoyan Stoyanov, Nadia Strusevich, Jahir Rizvi, Vincent Georgee, Jean Marc Yannou, Chris Bailey

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fingerprint

Dive into the research topics of 'Design for reliability for wafer level system in package'. Together they form a unique fingerprint.

Keyphrases

Engineering