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Dendritic Identifiers as Oracles in Microelectronics

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Improvements in transparency, trust, and assurance in microelectronics manufacturing demand a new approach to establishing the identity of individual parts. Whereas permissioned blockchains are now being used to secure critical supply chains, the microelectronics industry still lacks a suitable oracle - the element which acts as the bridge between the blockchain and items in the real world - that meets cost, security, and physical compatibility requirements. In this paper, we present our pathfinding work on an approach to this issue, the Dendritic Identifier (DI), which comprises an inexpensive and physically scalable 'fingerprint', which may be applied directly to components at trusted points in the supply chain, coupled with feature detection and matching software. Item-level uniqueness emerges from the high pattern (information) entropy caused by chaotic instabilities in the material systems used, with machine readability and robustness arising from the strong keypoints and low structural entropy of rule-based pattern formation. The subtle relief in the pattern yields security and copy resistance via patterns of reflected light that change with viewing or illumination angle. In the proposed use model, pattern keypoints and reflected light constellations would be extracted from reference images, encoded to complete the digital bridge, and subsequently used to establish component identity and authenticity from similarly converted images taken at various critical interaction points along the manufacturing supply chain.

Original languageEnglish (US)
Title of host publication2024 IEEE Physical Assurance and Inspection of Electronics, PAINE 2024
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9798331542252
DOIs
StatePublished - 2024
Externally publishedYes
Event2024 IEEE Physical Assurance and Inspection of Electronics, PAINE 2024 - Huntsville, United States
Duration: Nov 12 2024Nov 14 2024

Publication series

Name2024 IEEE Physical Assurance and Inspection of Electronics, PAINE 2024

Conference

Conference2024 IEEE Physical Assurance and Inspection of Electronics, PAINE 2024
Country/TerritoryUnited States
CityHuntsville
Period11/12/2411/14/24

Keywords

  • Dendritic Identifier
  • authenticity
  • identity
  • keypoints
  • microelectronics
  • oracle
  • traceability

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality
  • Instrumentation

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