Damage detection in integrated circuit packages using ultrasonic guided wave and clustering algorithm

Keyphrases

• Delamination 100%
• Damage Detection 100%
• Clustering Algorithm 100%
• Ultrasonic Guided Waves 100%
• Integrated Circuit Package 100%
• Wave Algorithm 100%
• Detection Accuracy 50%
• Reliable Detection 50%
• Detection Framework 50%
• Ultrasonic 50%
• Extracting Features 50%
• Feature Extraction Methods 50%
• Complex Structure 50%
• Time of Arrival 50%
• Interrogator 50%
• Heat Management 50%
• Small Structure 50%
• Robust Detection 50%
• Sealant 50%
• Density-based Spatial Clustering of Applications with Noise (DBSCAN) 50%
• Inspection Method 50%
• Matching Pursuit Decomposition 50%
• Automatic Feature Extraction 50%
• Integrated Heat Sink 50%
• Inspection Efficiency 50%
• Unsupervised Machine Learning Algorithms 50%
• Interface Delamination 50%

Engineering

• Ultrasonics 100%
• Damage Detection 100%
• Guided Wave 100%
• Clustering Algorithm 100%
• Integrated Circuit 100%
• Delamination 100%
• Machine Learning Algorithm 33%
• Feature Extraction 33%
• Complex Structure 33%
• Extracted Feature 33%
• Time-of-Arrival 33%
• Good Agreement 33%
• Interrogator 33%
• Inspection Method 33%
• Matching Pursuit 33%

Chemical Engineering

• Learning System 100%