Correction to: Influence of Substrate Surface Finish Metallurgy on Lead-Free Solder Joint Microstructure with Implications for Board-Level Reliability (Journal of Electronic Materials, (2020), 49, 5, (3251-3258), 10.1007/s11664-020-08013-0)

Marion Branch Kelly; Tapabrata Maity; A. R. Nazmus Sakib; D. R. Frear; Nikhilesh Chawla

doi:10.1007/s11664-020-08156-0

Correction to: Influence of Substrate Surface Finish Metallurgy on Lead-Free Solder Joint Microstructure with Implications for Board-Level Reliability (Journal of Electronic Materials, (2020), 49, 5, (3251-3258), 10.1007/s11664-020-08013-0)

Marion Branch Kelly, Tapabrata Maity, A. R. Nazmus Sakib, D. R. Frear, Nikhilesh Chawla

Engineering, Ira A. Fulton Schools of (IAFSE)

Research output: Contribution to journal › Comment/debate › peer-review

Abstract

In the original article, there is an error in Fig. 1. Following is the corrected Fig. 1. (Figure presented.).

Original language	English (US)
Pages (from-to)	4466-4467
Number of pages	2
Journal	Journal of Electronic Materials
Volume	49
Issue number	7
DOIs	https://doi.org/10.1007/s11664-020-08156-0
State	Published - Jul 1 2020

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

Access to Document

10.1007/s11664-020-08156-0

Fingerprint

Dive into the research topics of 'Correction to: Influence of Substrate Surface Finish Metallurgy on Lead-Free Solder Joint Microstructure with Implications for Board-Level Reliability (Journal of Electronic Materials, (2020), 49, 5, (3251-3258), 10.1007/s11664-020-08013-0)'. Together they form a unique fingerprint.

Cite this

Kelly, M. B., Maity, T., Nazmus Sakib, A. R., Frear, D. R., & Chawla, N. (2020). Correction to: Influence of Substrate Surface Finish Metallurgy on Lead-Free Solder Joint Microstructure with Implications for Board-Level Reliability (Journal of Electronic Materials, (2020), 49, 5, (3251-3258), 10.1007/s11664-020-08013-0). Journal of Electronic Materials, 49(7), 4466-4467. https://doi.org/10.1007/s11664-020-08156-0

Correction to: Influence of Substrate Surface Finish Metallurgy on Lead-Free Solder Joint Microstructure with Implications for Board-Level Reliability (Journal of Electronic Materials, (2020), 49, 5, (3251-3258), 10.1007/s11664-020-08013-0). / Kelly, Marion Branch; Maity, Tapabrata; Nazmus Sakib, A. R. et al.
In: Journal of Electronic Materials, Vol. 49, No. 7, 01.07.2020, p. 4466-4467.

Research output: Contribution to journal › Comment/debate › peer-review

Kelly, MB, Maity, T, Nazmus Sakib, AR, Frear, DR & Chawla, N 2020, 'Correction to: Influence of Substrate Surface Finish Metallurgy on Lead-Free Solder Joint Microstructure with Implications for Board-Level Reliability (Journal of Electronic Materials, (2020), 49, 5, (3251-3258), 10.1007/s11664-020-08013-0)', Journal of Electronic Materials, vol. 49, no. 7, pp. 4466-4467. https://doi.org/10.1007/s11664-020-08156-0

Kelly MB, Maity T, Nazmus Sakib AR, Frear DR, Chawla N. Correction to: Influence of Substrate Surface Finish Metallurgy on Lead-Free Solder Joint Microstructure with Implications for Board-Level Reliability (Journal of Electronic Materials, (2020), 49, 5, (3251-3258), 10.1007/s11664-020-08013-0). Journal of Electronic Materials. 2020 Jul 1;49(7):4466-4467. doi: 10.1007/s11664-020-08156-0

Kelly, Marion Branch ; Maity, Tapabrata ; Nazmus Sakib, A. R. et al. / Correction to : Influence of Substrate Surface Finish Metallurgy on Lead-Free Solder Joint Microstructure with Implications for Board-Level Reliability (Journal of Electronic Materials, (2020), 49, 5, (3251-3258), 10.1007/s11664-020-08013-0). In: Journal of Electronic Materials. 2020 ; Vol. 49, No. 7. pp. 4466-4467.

@article{e0597bf545f34393a069caa56c844c25,

title = "Correction to: Influence of Substrate Surface Finish Metallurgy on Lead-Free Solder Joint Microstructure with Implications for Board-Level Reliability (Journal of Electronic Materials, (2020), 49, 5, (3251-3258), 10.1007/s11664-020-08013-0)",

abstract = "In the original article, there is an error in Fig. 1. Following is the corrected Fig. 1. (Figure presented.).",

author = "Kelly, {Marion Branch} and Tapabrata Maity and {Nazmus Sakib}, {A. R.} and Frear, {D. R.} and Nikhilesh Chawla",

note = "Publisher Copyright: {\textcopyright} 2020, The Minerals, Metals & Materials Society.",

year = "2020",

month = jul,

day = "1",

doi = "10.1007/s11664-020-08156-0",

language = "English (US)",

volume = "49",

pages = "4466--4467",

journal = "Journal of Electronic Materials",

issn = "0361-5235",

publisher = "Springer New York",

number = "7",

}

TY - JOUR

T1 - Correction to

T2 - Influence of Substrate Surface Finish Metallurgy on Lead-Free Solder Joint Microstructure with Implications for Board-Level Reliability (Journal of Electronic Materials, (2020), 49, 5, (3251-3258), 10.1007/s11664-020-08013-0)

AU - Kelly, Marion Branch

AU - Maity, Tapabrata

AU - Nazmus Sakib, A. R.

AU - Frear, D. R.

AU - Chawla, Nikhilesh

PY - 2020/7/1

Y1 - 2020/7/1

N2 - In the original article, there is an error in Fig. 1. Following is the corrected Fig. 1. (Figure presented.).

AB - In the original article, there is an error in Fig. 1. Following is the corrected Fig. 1. (Figure presented.).

UR - http://www.scopus.com/inward/record.url?scp=85084355981&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85084355981&partnerID=8YFLogxK

U2 - 10.1007/s11664-020-08156-0

DO - 10.1007/s11664-020-08156-0

M3 - Comment/debate

AN - SCOPUS:85084355981

SN - 0361-5235

VL - 49

SP - 4466

EP - 4467

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

IS - 7

ER -

Correction to: Influence of Substrate Surface Finish Metallurgy on Lead-Free Solder Joint Microstructure with Implications for Board-Level Reliability (Journal of Electronic Materials, (2020), 49, 5, (3251-3258), 10.1007/s11664-020-08013-0)

Abstract

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this