Contact angle measurements for adhesion energy evaluation of silver and copper films on parylene-n and SiO2 substrates

Kaustubh S. Gadre; Terry Alford

doi:10.1063/1.1530362

Contact angle measurements for adhesion energy evaluation of silver and copper films on parylene-n and SiO₂ substrates

Kaustubh S. Gadre, Terry Alford

Research output: Contribution to journal › Article › peer-review

52 Scopus citations

Abstract

Contact angle measurements for adhesion energy evaluation of silver and copper films on parylene-n and SiO₂ substrates were presented. Qualitative tape-test analysis suggested improved adhesion between copper or silver and Pa-n using a plasma treatment prior to metal deposition. Contact angle measurements were shown applicable to evaluate adhesion energy quantitatively.

Original language	English (US)
Pages (from-to)	919-923
Number of pages	5
Journal	Journal of Applied Physics
Volume	93
Issue number	2
DOIs	https://doi.org/10.1063/1.1530362
State	Published - Jan 15 2003

ASJC Scopus subject areas

Physics and Astronomy(all)

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@article{68b87ae712ea4cda90c0f7a90f9c0c40,

title = "Contact angle measurements for adhesion energy evaluation of silver and copper films on parylene-n and SiO2 substrates",

abstract = "Contact angle measurements for adhesion energy evaluation of silver and copper films on parylene-n and SiO2 substrates were presented. Qualitative tape-test analysis suggested improved adhesion between copper or silver and Pa-n using a plasma treatment prior to metal deposition. Contact angle measurements were shown applicable to evaluate adhesion energy quantitatively.",

author = "Gadre, {Kaustubh S.} and Terry Alford",

year = "2003",

month = jan,

day = "15",

doi = "10.1063/1.1530362",

language = "English (US)",

volume = "93",

pages = "919--923",

journal = "Journal of Applied Physics",

issn = "0021-8979",

publisher = "American Institute of Physics Publising LLC",

number = "2",

}

TY - JOUR

T1 - Contact angle measurements for adhesion energy evaluation of silver and copper films on parylene-n and SiO2 substrates

AU - Gadre, Kaustubh S.

AU - Alford, Terry

PY - 2003/1/15

Y1 - 2003/1/15

N2 - Contact angle measurements for adhesion energy evaluation of silver and copper films on parylene-n and SiO2 substrates were presented. Qualitative tape-test analysis suggested improved adhesion between copper or silver and Pa-n using a plasma treatment prior to metal deposition. Contact angle measurements were shown applicable to evaluate adhesion energy quantitatively.

AB - Contact angle measurements for adhesion energy evaluation of silver and copper films on parylene-n and SiO2 substrates were presented. Qualitative tape-test analysis suggested improved adhesion between copper or silver and Pa-n using a plasma treatment prior to metal deposition. Contact angle measurements were shown applicable to evaluate adhesion energy quantitatively.

UR - http://www.scopus.com/inward/record.url?scp=0037439456&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0037439456&partnerID=8YFLogxK

U2 - 10.1063/1.1530362

DO - 10.1063/1.1530362

M3 - Article

AN - SCOPUS:0037439456

SN - 0021-8979

VL - 93

SP - 919

EP - 923

JO - Journal of Applied Physics

JF - Journal of Applied Physics

IS - 2

ER -

Contact angle measurements for adhesion energy evaluation of silver and copper films on parylene-n and SiO₂ substrates

Abstract

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