Abstract
Cobalt films (1, 25 and 100 Å) have been directly deposited on top 6H-SiC(0001) wafers by molecular beam epitaxy and annealed at 500-8000C in UHV. The structure of the metal-semiconductor interface was investigated by XAFS. The results show that Co-Si bonds were preferentially formed in the 1 Å Co films. In the 25 and 100 Å Co films only Co-Co bonds were identified. The XRD pattern of the 100 Å Co film exhibits a Co (200) peak confirming the presence of unreacted metal even after annealing at 8000C.
Original language | English (US) |
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Pages (from-to) | 188-189 |
Number of pages | 2 |
Journal | Journal of synchrotron radiation |
Volume | 6 |
Issue number | 3 |
DOIs | |
State | Published - May 1 1999 |
Externally published | Yes |
Keywords
- Metal-semiconductor contacts
- Molecular beam epitaxy
- Silicon Carbide
ASJC Scopus subject areas
- Radiation
- Nuclear and High Energy Physics
- Instrumentation