Characterization and adhesion in Cu/Ru/SiO2/Si multilayer nano-scale structure for Cu metallization

Nikhilesh Chawla, S. H. Venkatesh, D. R P Singh, Terry Alford

Research output: Contribution to journalArticlepeer-review

2 Scopus citations


In this study, we have characterized the microstructure, resistivity, and dynamic deformation behavior of Cu/Ru/SiO2 and Cu/SiO2 samples under scratch loading conditions. Cu/Ru/SiO2 samples showed higher elastic recovery and hardness when compared to the Cu/SiO2 samples. In the case of Cu/Ru/SiO2 samples, Ru acts as a glue layer between the Cu and the SiO2 substrate providing both strength and toughness against dynamic loading. Hence, the critical load for delamination is higher for Cu/Ru/SiO2 samples compared to Cu/SiO2 samples. Our results show that Cu/Ru/SiO2 thin films present significant potential to be used in Cu metallization.

Original languageEnglish (US)
Pages (from-to)1085-1090
Number of pages6
JournalJournal of Materials Engineering and Performance
Issue number4
StatePublished - Apr 2013


  • advanced characterization
  • coatings
  • mechanical testing

ASJC Scopus subject areas

  • General Materials Science
  • Mechanics of Materials
  • Mechanical Engineering


Dive into the research topics of 'Characterization and adhesion in Cu/Ru/SiO2/Si multilayer nano-scale structure for Cu metallization'. Together they form a unique fingerprint.

Cite this