Addressing adhesion and reliability concerns of copper-plated c-Si solar cells and modules

Joseph Karas, Lynne Michaelson, Mariela Lizet Castillo, Krystal Munoz, Mark Bailly, Harsh Jain, Austin Akey, Jim Rand, Tom Tyson, Tonio Buonassisi, Stuart Bowden

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations


Copper-plated contacts for front side crystalline silicon solar cells are a topic of considerable interest, with many recent publications presenting a variety of successful methods and impressive cell results. Several of the more obvious challenges yet to be proven relate to the durability and reliability of plated contacts, especially the adhesion of plated metal to solar cells and the long-term stability of the metals that could potentially result in gradual power degradation. In this work, we have fabricated copper plated cells using several different front side patterning methods. For a resist-based process, we have optimized plated cell processing to achieve adhesion comparable to screenprinted silver paste contacts. For laser-based patterning methods, greater understanding of the metal-silicon interface and microstructure effecting adhesion is still needed.

Original languageEnglish (US)
Title of host publication2016 IEEE 43rd Photovoltaic Specialists Conference, PVSC 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Number of pages5
ISBN (Electronic)9781509027248
StatePublished - Nov 18 2016
Event43rd IEEE Photovoltaic Specialists Conference, PVSC 2016 - Portland, United States
Duration: Jun 5 2016Jun 10 2016

Publication series

NameConference Record of the IEEE Photovoltaic Specialists Conference
ISSN (Print)0160-8371


Other43rd IEEE Photovoltaic Specialists Conference, PVSC 2016
Country/TerritoryUnited States

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering


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