Addressing adhesion and reliability concerns of copper-plated c-Si solar cells and modules

Joseph Karas; Lynne Michaelson; Mariela Lizet Castillo; Krystal Munoz; Mark Bailly; Harsh Jain; Austin Akey; Jim Rand; Tom Tyson; Tonio Buonassisi; Stuart Bowden

doi:10.1109/PVSC.2016.7749739

Addressing adhesion and reliability concerns of copper-plated c-Si solar cells and modules

Joseph Karas, Lynne Michaelson, Mariela Lizet Castillo, Krystal Munoz, Mark Bailly, Harsh Jain, Austin Akey, Jim Rand, Tom Tyson, Tonio Buonassisi, Stuart Bowden

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Scopus citations

Abstract

Copper-plated contacts for front side crystalline silicon solar cells are a topic of considerable interest, with many recent publications presenting a variety of successful methods and impressive cell results. Several of the more obvious challenges yet to be proven relate to the durability and reliability of plated contacts, especially the adhesion of plated metal to solar cells and the long-term stability of the metals that could potentially result in gradual power degradation. In this work, we have fabricated copper plated cells using several different front side patterning methods. For a resist-based process, we have optimized plated cell processing to achieve adhesion comparable to screenprinted silver paste contacts. For laser-based patterning methods, greater understanding of the metal-silicon interface and microstructure effecting adhesion is still needed.

Original language	English (US)
Title of host publication	2016 IEEE 43rd Photovoltaic Specialists Conference, PVSC 2016
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	899-903
Number of pages	5
ISBN (Electronic)	9781509027248
DOIs	https://doi.org/10.1109/PVSC.2016.7749739
State	Published - Nov 18 2016
Event	43rd IEEE Photovoltaic Specialists Conference, PVSC 2016 - Portland, United States Duration: Jun 5 2016 → Jun 10 2016

Publication series

Name	Conference Record of the IEEE Photovoltaic Specialists Conference
Volume	2016-November
ISSN (Print)	0160-8371

Other

Other	43rd IEEE Photovoltaic Specialists Conference, PVSC 2016
Country/Territory	United States
City	Portland
Period	6/5/16 → 6/10/16

ASJC Scopus subject areas

Control and Systems Engineering
Industrial and Manufacturing Engineering
Electrical and Electronic Engineering

Access to Document

10.1109/PVSC.2016.7749739

Cite this

Karas, J., Michaelson, L., Castillo, M. L., Munoz, K., Bailly, M., Jain, H., Akey, A., Rand, J., Tyson, T., Buonassisi, T., & Bowden, S. (2016). Addressing adhesion and reliability concerns of copper-plated c-Si solar cells and modules. In 2016 IEEE 43rd Photovoltaic Specialists Conference, PVSC 2016 (pp. 899-903). Article 7749739 (Conference Record of the IEEE Photovoltaic Specialists Conference; Vol. 2016-November). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/PVSC.2016.7749739

Addressing adhesion and reliability concerns of copper-plated c-Si solar cells and modules. / Karas, Joseph; Michaelson, Lynne; Castillo, Mariela Lizet et al.
2016 IEEE 43rd Photovoltaic Specialists Conference, PVSC 2016. Institute of Electrical and Electronics Engineers Inc., 2016. p. 899-903 7749739 (Conference Record of the IEEE Photovoltaic Specialists Conference; Vol. 2016-November).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Karas, J, Michaelson, L, Castillo, ML, Munoz, K, Bailly, M, Jain, H, Akey, A, Rand, J, Tyson, T, Buonassisi, T & Bowden, S 2016, Addressing adhesion and reliability concerns of copper-plated c-Si solar cells and modules. in 2016 IEEE 43rd Photovoltaic Specialists Conference, PVSC 2016., 7749739, Conference Record of the IEEE Photovoltaic Specialists Conference, vol. 2016-November, Institute of Electrical and Electronics Engineers Inc., pp. 899-903, 43rd IEEE Photovoltaic Specialists Conference, PVSC 2016, Portland, United States, 6/5/16. https://doi.org/10.1109/PVSC.2016.7749739

Karas J, Michaelson L, Castillo ML, Munoz K, Bailly M, Jain H et al. Addressing adhesion and reliability concerns of copper-plated c-Si solar cells and modules. In 2016 IEEE 43rd Photovoltaic Specialists Conference, PVSC 2016. Institute of Electrical and Electronics Engineers Inc. 2016. p. 899-903. 7749739. (Conference Record of the IEEE Photovoltaic Specialists Conference). doi: 10.1109/PVSC.2016.7749739

@inproceedings{144364be8437426f9076bb1abbca952a,

title = "Addressing adhesion and reliability concerns of copper-plated c-Si solar cells and modules",

abstract = "Copper-plated contacts for front side crystalline silicon solar cells are a topic of considerable interest, with many recent publications presenting a variety of successful methods and impressive cell results. Several of the more obvious challenges yet to be proven relate to the durability and reliability of plated contacts, especially the adhesion of plated metal to solar cells and the long-term stability of the metals that could potentially result in gradual power degradation. In this work, we have fabricated copper plated cells using several different front side patterning methods. For a resist-based process, we have optimized plated cell processing to achieve adhesion comparable to screenprinted silver paste contacts. For laser-based patterning methods, greater understanding of the metal-silicon interface and microstructure effecting adhesion is still needed.",

author = "Joseph Karas and Lynne Michaelson and Castillo, {Mariela Lizet} and Krystal Munoz and Mark Bailly and Harsh Jain and Austin Akey and Jim Rand and Tom Tyson and Tonio Buonassisi and Stuart Bowden",

note = "Publisher Copyright: {\textcopyright} 2016 IEEE.; 43rd IEEE Photovoltaic Specialists Conference, PVSC 2016 ; Conference date: 05-06-2016 Through 10-06-2016",

year = "2016",

month = nov,

day = "18",

doi = "10.1109/PVSC.2016.7749739",

language = "English (US)",

series = "Conference Record of the IEEE Photovoltaic Specialists Conference",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "899--903",

booktitle = "2016 IEEE 43rd Photovoltaic Specialists Conference, PVSC 2016",

}

TY - GEN

T1 - Addressing adhesion and reliability concerns of copper-plated c-Si solar cells and modules

AU - Karas, Joseph

AU - Michaelson, Lynne

AU - Castillo, Mariela Lizet

AU - Munoz, Krystal

AU - Bailly, Mark

AU - Jain, Harsh

AU - Akey, Austin

AU - Rand, Jim

AU - Tyson, Tom

AU - Buonassisi, Tonio

AU - Bowden, Stuart

PY - 2016/11/18

Y1 - 2016/11/18

N2 - Copper-plated contacts for front side crystalline silicon solar cells are a topic of considerable interest, with many recent publications presenting a variety of successful methods and impressive cell results. Several of the more obvious challenges yet to be proven relate to the durability and reliability of plated contacts, especially the adhesion of plated metal to solar cells and the long-term stability of the metals that could potentially result in gradual power degradation. In this work, we have fabricated copper plated cells using several different front side patterning methods. For a resist-based process, we have optimized plated cell processing to achieve adhesion comparable to screenprinted silver paste contacts. For laser-based patterning methods, greater understanding of the metal-silicon interface and microstructure effecting adhesion is still needed.

AB - Copper-plated contacts for front side crystalline silicon solar cells are a topic of considerable interest, with many recent publications presenting a variety of successful methods and impressive cell results. Several of the more obvious challenges yet to be proven relate to the durability and reliability of plated contacts, especially the adhesion of plated metal to solar cells and the long-term stability of the metals that could potentially result in gradual power degradation. In this work, we have fabricated copper plated cells using several different front side patterning methods. For a resist-based process, we have optimized plated cell processing to achieve adhesion comparable to screenprinted silver paste contacts. For laser-based patterning methods, greater understanding of the metal-silicon interface and microstructure effecting adhesion is still needed.

UR - http://www.scopus.com/inward/record.url?scp=85003707748&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85003707748&partnerID=8YFLogxK

U2 - 10.1109/PVSC.2016.7749739

DO - 10.1109/PVSC.2016.7749739

M3 - Conference contribution

AN - SCOPUS:85003707748

T3 - Conference Record of the IEEE Photovoltaic Specialists Conference

SP - 899

EP - 903

BT - 2016 IEEE 43rd Photovoltaic Specialists Conference, PVSC 2016

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 43rd IEEE Photovoltaic Specialists Conference, PVSC 2016

Y2 - 5 June 2016 through 10 June 2016

ER -

Addressing adhesion and reliability concerns of copper-plated c-Si solar cells and modules

Abstract

Publication series

Other

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this