A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints

Yilun Xu; Jingwei Xian; Stoyan Stoyanov; Chris Bailey; Richard J. Coyle; Christopher M. Gourlay; Fionn P.E. Dunne

doi:10.1016/j.ijplas.2022.103308

A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints

Yilun Xu
, Jingwei Xian
, Stoyan Stoyanov
, Chris Bailey
, Richard J. Coyle
, Christopher M. Gourlay
, Fionn P.E. Dunne

Research output: Contribution to journal › Article › peer-review

55 Scopus citations

Abstract

This paper presents a multi-scale modelling approach to investigate the underpinning mechanisms of microstructure-sensitive damage of single crystal Sn-3Ag-0.5Cu (wt%, SAC305) solder joints of a Ball Grid Array (BGA) board assembly subject to thermal cycling. The multi-scale scheme couples board-scale modelling at the continuum macro-scale and individual solder modelling at the crystal micro-scale. Systematic studies of tin crystal orientation and its role in fatigue damage have been compared to experimental observations. Crystallographic orientation is examined with respect to damage development, providing evidence-based optimal solder microstructural design for in-service thermomechanical fatigue.

Original language	English (US)
Article number	103308
Journal	International Journal of Plasticity
Volume	155
DOIs	https://doi.org/10.1016/j.ijplas.2022.103308
State	Published - Aug 2022
Externally published	Yes

Keywords

Crystal plasticity
Microstructure
Multi-scale modelling
SAC305, thermal fatigue
Solder joints

ASJC Scopus subject areas

General Materials Science
Mechanics of Materials
Mechanical Engineering

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10.1016/j.ijplas.2022.103308

Cite this

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title = "A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints",

abstract = "This paper presents a multi-scale modelling approach to investigate the underpinning mechanisms of microstructure-sensitive damage of single crystal Sn-3Ag-0.5Cu (wt\%, SAC305) solder joints of a Ball Grid Array (BGA) board assembly subject to thermal cycling. The multi-scale scheme couples board-scale modelling at the continuum macro-scale and individual solder modelling at the crystal micro-scale. Systematic studies of tin crystal orientation and its role in fatigue damage have been compared to experimental observations. Crystallographic orientation is examined with respect to damage development, providing evidence-based optimal solder microstructural design for in-service thermomechanical fatigue.",

keywords = "Crystal plasticity, Microstructure, Multi-scale modelling, SAC305, thermal fatigue, Solder joints",

author = "Yilun Xu and Jingwei Xian and Stoyan Stoyanov and Chris Bailey and Coyle, \{Richard J.\} and Gourlay, \{Christopher M.\} and Dunne, \{Fionn P.E.\}",

note = "Publisher Copyright: {\textcopyright} 2022 The Author(s).",

year = "2022",

month = aug,

doi = "10.1016/j.ijplas.2022.103308",

language = "English (US)",

volume = "155",

journal = "International Journal of Plasticity",

issn = "0749-6419",

publisher = "Elsevier Ltd",

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T1 - A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints

AU - Xu, Yilun

AU - Xian, Jingwei

AU - Stoyanov, Stoyan

AU - Bailey, Chris

AU - Coyle, Richard J.

AU - Gourlay, Christopher M.

AU - Dunne, Fionn P.E.

PY - 2022/8

Y1 - 2022/8

N2 - This paper presents a multi-scale modelling approach to investigate the underpinning mechanisms of microstructure-sensitive damage of single crystal Sn-3Ag-0.5Cu (wt%, SAC305) solder joints of a Ball Grid Array (BGA) board assembly subject to thermal cycling. The multi-scale scheme couples board-scale modelling at the continuum macro-scale and individual solder modelling at the crystal micro-scale. Systematic studies of tin crystal orientation and its role in fatigue damage have been compared to experimental observations. Crystallographic orientation is examined with respect to damage development, providing evidence-based optimal solder microstructural design for in-service thermomechanical fatigue.

AB - This paper presents a multi-scale modelling approach to investigate the underpinning mechanisms of microstructure-sensitive damage of single crystal Sn-3Ag-0.5Cu (wt%, SAC305) solder joints of a Ball Grid Array (BGA) board assembly subject to thermal cycling. The multi-scale scheme couples board-scale modelling at the continuum macro-scale and individual solder modelling at the crystal micro-scale. Systematic studies of tin crystal orientation and its role in fatigue damage have been compared to experimental observations. Crystallographic orientation is examined with respect to damage development, providing evidence-based optimal solder microstructural design for in-service thermomechanical fatigue.

KW - Crystal plasticity

KW - Microstructure

KW - Multi-scale modelling

KW - SAC305, thermal fatigue

KW - Solder joints

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UR - https://www.scopus.com/pages/publications/85131930253#tab=citedBy

U2 - 10.1016/j.ijplas.2022.103308

DO - 10.1016/j.ijplas.2022.103308

M3 - Article

AN - SCOPUS:85131930253

SN - 0749-6419

VL - 155

JO - International Journal of Plasticity

JF - International Journal of Plasticity

M1 - 103308

ER -

A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints

Abstract

Keywords

ASJC Scopus subject areas

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