A high-performance surface-micromachined pirani gauge in summit V™

Brian H. Stark; Junseok Chae; Andrew Kuo; Andrew Oliver; Khalil Najafi

A high-performance surface-micromachined pirani gauge in summit V™

Brian H. Stark, Junseok Chae, Andrew Kuo, Andrew Oliver, Khalil Najafi

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

This paper presents a new type of surface micromachined polysilicon Pirani gauge that is designed to monitor pressure in micro packages. This gauge can measure absolute pressure from greater than 760Torr to less than 10mTorr. The gauge utilizes a double heat sink design to maximize dynamic range while maintaining adequate pressure sensitivity (∼1×10 ³(K/W)/ Torr). A special feature of this gauge is that it achieves high performance using a widely available foundry process. This sensor can be integrated with other devices on the same substrate and packaged to measure leak rates several orders of magnitude smaller than traditional He leak testing.

Original language	English (US)
Title of host publication	Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Pages	295-298
Number of pages	4
State	Published - 2005
Externally published	Yes
Event	18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami - Miami Beach, FL, United States Duration: Jan 30 2005 → Feb 3 2005

Other

Other	18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami
Country/Territory	United States
City	Miami Beach, FL
Period	1/30/05 → 2/3/05

ASJC Scopus subject areas

Mechanical Engineering
Electrical and Electronic Engineering
Control and Systems Engineering

Cite this

Stark, BH, Chae, J, Kuo, A, Oliver, A & Najafi, K 2005, A high-performance surface-micromachined pirani gauge in summit V™. in Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)., TPa13, pp. 295-298, 18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami, Miami Beach, FL, United States, 1/30/05.

@inproceedings{8df89fad16b846d4b3e211853e8cb206,

title = "A high-performance surface-micromachined pirani gauge in summit V{\texttrademark}",

abstract = "This paper presents a new type of surface micromachined polysilicon Pirani gauge that is designed to monitor pressure in micro packages. This gauge can measure absolute pressure from greater than 760Torr to less than 10mTorr. The gauge utilizes a double heat sink design to maximize dynamic range while maintaining adequate pressure sensitivity (∼1×10 3(K/W)/ Torr). A special feature of this gauge is that it achieves high performance using a widely available foundry process. This sensor can be integrated with other devices on the same substrate and packaged to measure leak rates several orders of magnitude smaller than traditional He leak testing.",

author = "Stark, {Brian H.} and Junseok Chae and Andrew Kuo and Andrew Oliver and Khalil Najafi",

year = "2005",

language = "English (US)",

pages = "295--298",

booktitle = "Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)",

note = "18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami ; Conference date: 30-01-2005 Through 03-02-2005",

}

TY - GEN

T1 - A high-performance surface-micromachined pirani gauge in summit V™

AU - Stark, Brian H.

AU - Chae, Junseok

AU - Kuo, Andrew

AU - Oliver, Andrew

AU - Najafi, Khalil

PY - 2005

Y1 - 2005

N2 - This paper presents a new type of surface micromachined polysilicon Pirani gauge that is designed to monitor pressure in micro packages. This gauge can measure absolute pressure from greater than 760Torr to less than 10mTorr. The gauge utilizes a double heat sink design to maximize dynamic range while maintaining adequate pressure sensitivity (∼1×10 3(K/W)/ Torr). A special feature of this gauge is that it achieves high performance using a widely available foundry process. This sensor can be integrated with other devices on the same substrate and packaged to measure leak rates several orders of magnitude smaller than traditional He leak testing.

AB - This paper presents a new type of surface micromachined polysilicon Pirani gauge that is designed to monitor pressure in micro packages. This gauge can measure absolute pressure from greater than 760Torr to less than 10mTorr. The gauge utilizes a double heat sink design to maximize dynamic range while maintaining adequate pressure sensitivity (∼1×10 3(K/W)/ Torr). A special feature of this gauge is that it achieves high performance using a widely available foundry process. This sensor can be integrated with other devices on the same substrate and packaged to measure leak rates several orders of magnitude smaller than traditional He leak testing.

UR - http://www.scopus.com/inward/record.url?scp=26844444276&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=26844444276&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:26844444276

SP - 295

EP - 298

BT - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

T2 - 18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami

Y2 - 30 January 2005 through 3 February 2005

ER -

A high-performance surface-micromachined pirani gauge in summit V™

Abstract

Other

ASJC Scopus subject areas

Other files and links

Fingerprint

Cite this