A fast I-V screening measurement for tddb assessment of ultra-thick inter-metal dielectrics

Arash Elhami Khorasani, Mark Griswold, Terry Alford

Research output: Contribution to journalArticlepeer-review

8 Scopus citations


Semiconductor manufacturing economics necessitate the development of novel and innovative techniques that can replace the traditional time consuming reliability methods, i.e., the constant voltage stress time-dependent dielectric breakdown (CVS-TDDB) tests. We show that positive charge trapping is a dominant process when ultra-thick oxides are stressed through the ramped voltage test. Exploiting the physics behind positive charge generation/trapping at high electric fields, a fast I-V measurement technique is proposed that can be used to effectively distinguish the ultra-thick oxides' intrinsic quality at low electric fields. It will be demonstrated, based on experimental data, that our proposed technique can be a suitable replacement for the CVS-TDDB as a quality screening tool.

Original languageEnglish (US)
Article number6680596
Pages (from-to)117-119
Number of pages3
JournalIEEE Electron Device Letters
Issue number1
StatePublished - Jan 2014


  • Time-dependent dielectric breakdown (TDDB)
  • V-ramp
  • oxide reliability
  • semiconductor device measurements

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering


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