Engineering
Joints (Structural Components)
100%
Finite Element Analysis
64%
Interconnects
62%
Free Solder
58%
Powder Bed
57%
Intermetallics
46%
Carbon Nanotube
46%
Mechanical Property
42%
Mg-Al Alloy
41%
Additive Manufacturing
40%
Damage Model
38%
Melt Pool
37%
Damage Evolution
36%
Melting Point
34%
Fatigue Damage
33%
Powder Bed Fusion
33%
Microelectronics
33%
Additive Manufacturing Process
31%
Finite Element Modeling
30%
Microscale
28%
Yield Point
25%
Finite Element Simulation
24%
Crack Initiation
24%
Melting Process
24%
Fem Model
23%
Interdiffusion
22%
Tensile Test
21%
Process Parameter
21%
Integral Abutment Bridge
20%
Ball Grid Arrays
20%
Damage Propagation
20%
Creep
19%
Fatigue Life
19%
Ultimate Tensile Strength
18%
Integrated Circuit
17%
Porosity
17%
Computer Simulation
17%
Propagation Path
17%
Damage Initiation
17%
Model Constant
17%
Electron Beam Melting
17%
Strain Rate
17%
Laser Melting
17%
Cyclic Fatigue
17%
Structural Reliability
16%
Actuator
16%
Additive Manufacturing Technology
16%
Scatterer
15%
Multiscale
15%
Modulus of Elasticity
15%
Keyphrases
Solder Joint
73%
Additive Manufacturing
55%
Microstructure
47%
Powder Bed
44%
Mechanical Behavior
44%
Al-Mg Alloy
41%
Ti-6Al-4V (Ti64)
40%
Three-dimensional (3D)
37%
Carbon Nanotubes
34%
Intermetallics
32%
Thermomechanical
32%
High Temperature
32%
Viscoplastic Material
31%
Finite Element Analysis
29%
Additive Manufacturing Process
29%
Ultrafine Grain
29%
Mechanical Properties
27%
Solid-liquid Interdiffusion
26%
Peak Density
26%
Electron Beam
26%
Damage Evolution
26%
Pb-free Solder
26%
Energy Partitioning
26%
Bimodal Grain Size
25%
Intermetallic Compounds
25%
Solder Material
24%
Nanoindentation
24%
Microelectronics
24%
3D IC
24%
Through Silicon via
23%
Material Properties
23%
Ag3Sn
23%
Damage Model
23%
Inconel 718 (IN718)
22%
Finite Element Simulation
22%
Finite Element Modeling
22%
Modeling Approach
21%
Damage Initiation
21%
Grain Growth
20%
Integral Abutment Bridge
20%
Cu6Sn5
20%
Metal Additive Manufacturing
20%
Solder Interconnect
20%
Finite Element Model
19%
Fatigue Life
19%
BGA Solder Joint
18%
Cu6Sn5 Intermetallic
18%
Melt Pool
18%
Lead-free Solder Joints
18%
Thermomechanical Reliability
17%
Material Science
Solder Joint
92%
Intermetallics
71%
Finite Element Method
65%
Grain Size
62%
Three Dimensional Printing
59%
Anisotropy
47%
Carbon Nanotube
46%
Magnesium Alloys
41%
Mechanical Property
41%
Finite Element Modeling
37%
Lead-Free Solder
35%
Surface (Surface Science)
31%
Damage Evolution
31%
Nanoindentation
29%
Electronic Circuit
28%
Silicon
25%
Density
24%
Fatigue Damage
24%
Strain Rate
22%
Yield Stress
21%
Inconel 718
20%
Elastic Moduli
20%
Creep
20%
Materials Property
17%
Viscoplastic Material
17%
Crystal Plasticity
17%
Experimental Design
17%
Solidification
17%
Composite Material
17%
Electron Backscatter Diffraction
16%
Thermal Cycling
15%
Crack Propagation
13%
Crack Initiation
13%
Strength of Materials
13%
Powder Bed Fusion
13%
Ultimate Tensile Strength
13%
Single Crystal
13%
Grain Boundary
11%
Low-Cycle Fatigue
11%
Mechanical Testing
11%
Fatigue of Materials
11%
Nucleation
10%
Nanocrystalline
10%
Aluminum Alloy
10%
Surface Roughness
10%
Fatigue Crack
10%
Work Hardening
9%
Electron Beam Powder Bed Fusion
9%
Crystal Microstructure
9%
Plastic Deformation
8%