Engineering
Joints (Structural Components)
100%
Power Electronics
76%
Electronic Module
57%
Finite Element Analysis
53%
Microelectronics
40%
Interconnects
38%
Computational Fluid Dynamics
36%
Electronic Packaging
29%
Free Solder
28%
Fluid Flow
24%
Conductive Adhesive
23%
Printed Circuit Board
22%
Underfill
22%
Anisotropic Conductive Film
22%
Numerical Modeling
22%
Microchannel
20%
Manufacturing Process
18%
Electronic Product
18%
Thermal Stress
17%
Finite Volume Method
16%
Dielectrics
16%
Assembly Process
16%
Thermal Model
14%
Failure Mechanism
14%
Numerical Model
13%
Microwave Curing
13%
Ball Grid Arrays
13%
Design Optimization
13%
Light-Emitting Diode
13%
Printed Electronics
13%
Computer Simulation
12%
Transients
12%
Experimental Result
12%
Solid Mechanics
12%
Fem Model
12%
Reliability Analysis
12%
Microsystem
12%
Temperature Distribution
12%
System-in-Package
12%
Microvias
12%
Remaining Life
11%
Reliability Prediction
11%
Design Parameter
11%
Three Dimensional Printing
11%
Cutty Sark
11%
Design for Reliability
10%
Modeling Study
10%
Thermodynamics
10%
Microscale
10%
Simulation Result
10%
Keyphrases
Solder Joint
69%
Soldering
59%
Power Electronic Module
53%
Flip chip
47%
Electronic Packaging
39%
Electronic Components
33%
Power Module
24%
Modeling Techniques
23%
Power Electronics
23%
Multiphysics
22%
Anisotropic Conductive Film
22%
Lead-free Solder
21%
Bond Wire
21%
Flip-chip Assembly
21%
Computational Fluid Dynamics
20%
Reliability Prediction
19%
Fluid Flow
19%
Printed Circuit Board
19%
Computer Modeling
19%
Computational Modeling
18%
Underfill
18%
Solder Interconnect
18%
Finite Element Analysis
18%
Microwave Oven
17%
Numerical Modeling
17%
Electronic Products
17%
Multiphysics Modeling
16%
Unstructured Mesh
16%
Thermal Cycling
15%
Assembly Process
15%
Lead-free
15%
Thermo-mechanical Analysis
14%
Modeling Approach
14%
Numerical Model
14%
Solder Material
14%
Microwave Curing
14%
Thermal Stress
14%
Microelectronics
14%
Manufacturing Process
14%
Finite Volume
14%
Failure Mechanism
13%
Microvia
13%
Modeling Methodology
13%
Design Optimization
13%
Finite Volume Method
13%
Lifetime Prediction
13%
High Reliability
12%
Electronic System
12%
Microelectronics Packaging
12%
Material Properties
12%
